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DRC - (Final DRC)
7 v0 V! \! r& s' J -----------------
$ L3 s" X8 P- l5 {+ U& v% d5 V& ~" N7 ?% F
08:00 AM TuESDay, September 09, 2008
; s7 ^1 O2 g( U& C" o Job Name: D:\prj\080906\PCB\22V1.0.pcb
" J5 K5 A* W2 N0 Q) K6 [- r
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PROXIMITY
& C4 B3 Z* Q: S: X' V --------- z3 N$ P# ^+ L$ e5 \: [6 I7 ]
$ t5 ?* I: i% ]# S$ L Use DRC Window : NO
# b1 T) V1 [& D: ~! X. F8 I9 Z( ?& w6 Z7 e- Q
! P9 s& n" Y: _, T
Disable Same Cell Pad-Pad Checks : NO+ W4 K8 U! F4 d0 i5 q, D# z+ p
* m# X6 K7 ?3 D$ u# k
3 R+ W# c% u, g' ^; A
Enable Same Net Pad-Pad Checks : NO
* F2 j! E) Q2 Y. t# l- o# _# S; x N9 Z N
+ r% \. x1 i: X
Layers Specifed To Check : Layer 16 u1 ]' J* \6 l1 D& b4 Z
Layer 2
3 y7 e' N; P& h! L0 P1 y( V! `+ ? k7 x5 t, G8 _$ E% V. {- Y
" j% I) G, U3 i! g- h' D
' r" B1 t! |% Y0 A: Q+ }% F, g+ j
) Z" s- M3 S2 g V8 U3 B9 [ Net Class Clearances And Rules- u. \1 q% I& W- C) C
------------------------------
0 T8 | r# j8 b* h% _4 V! Z" H8 s) ]# Q
>> Components Top TO Components Top
/ d7 D' S; `" b% J" Y7 R Hazards Found : 4
3 r- m0 z, F1 E
, o" W8 u/ s( O1 m Traces Layer 1 TO Traces Layer 1 u5 F8 z% R V1 V- |" h
No Hazards.
! R" f0 }3 f. s& [' ?. d" f! l5 m. s' W% W; z9 w2 _
Traces Layer 1 TO Part pads SMD Layer 18 e4 L+ y0 h7 E a! T( B9 k
No Hazards.
; E6 g; M5 Z! G) l* V
; o, m6 F1 P3 Z/ g8 x9 E Traces Layer 1 TO Part Pads Thru Layer 1
% z0 s, q j; S, g6 x/ Z No Hazards.5 p1 j* V, t; X. G
! `" Z6 {5 {1 t
Traces Layer 1 TO Part Holes Layer 1" u3 x9 x; W2 H/ n V! T% N
No Hazards.0 L m% m R1 [& g
) X( W$ X7 [. l! {6 d0 B& F Traces Layer 1 TO Via Pads Layer 1
8 C1 ~ d) k3 _ No Hazards.
, h) m8 v' A: X7 S8 n; y, }# o
Traces Layer 1 TO Via Holes Layer 1
) ~7 ^3 c# X: } W! q8 |9 P0 p3 r No Hazards." U$ Q" Q6 }4 M0 M7 E
! V' K- T, ]& ~- q/ b2 C
Part Pads SMD Layer 1 TO Part Pads SMD Layer 1
( {- y1 {& F% F7 o No Hazards.# m+ q C9 q: s; u8 g/ d [- d
' y( z/ c7 g. A0 k9 M/ \ Part Pads SMD Layer 1 TO Part Pads Thru Layer 12 k/ r1 S7 k3 {+ q8 {
No Hazards.4 u$ ]- |& a0 T' ]2 q
: m, @5 c/ W; N8 u* f Part Pads SMD Layer 1 TO Part Holes Layer 1! @+ l3 D, E% e9 h& y; s
No Hazards.
Q2 D- _# Y0 V3 ]7 s8 f( l
' F) \) T6 `. N& k0 m* v Part Pads SMD Layer 1 TO Via Pads Layer 1
+ p# P# D0 r9 |) L No Hazards.) {9 [3 W% o `5 |, @8 c
% N* ?# [% P u
Part Pads SMD Layer 1 TO Via Holes Layer 1
& V- T8 W- T/ D, |; G/ G" f No Hazards.
! t3 S N5 e" W2 W1 t" x0 `/ n7 `! x& U% F( U4 J6 M2 d- {
Part Pads Thru Layer 1 TO Part Pads Thru Layer 14 ^, Q+ J* \( x
No Hazards.
# B- Y- Q2 e0 E1 ]1 n
) ^: I8 d l( x Part Pads Thru Layer 1 TO Part Holes Layer 1# x: O9 S2 d* p+ t
No Hazards.3 |. |6 M5 Y( {- a( k, ^
6 U( W0 I0 I* @% T# L0 Q1 s6 { Part Pads Thru Layer 1 TO Via Pads Layer 1% B2 q+ x) m# G! j. I! {3 }
No Hazards.+ e8 A: A1 ]8 ?' @- h5 B6 w6 y
3 J0 L) _ U+ k; ]
Part Pads Thru Layer 1 TO Via Holes Layer 11 i. w) `/ O }- B ~, ]/ g
No Hazards.
; ^, ]6 X! k& F" e- [2 _* D
& _, Z; S9 v3 ^ n, n8 ^/ [3 X9 a Part Holes Layer 1 TO Via Pads Layer 1: ]) M* ~- c, s. L
No Hazards.7 c& c" f. P# R! e0 x; b( c
+ g( Q3 H9 E, R' n( |
Part Holes Layer 1 TO Via Holes Layer 1
" B9 R" ]& q% k8 G5 b/ Q No Hazards.
+ E+ _! ^% p2 Q4 i9 Z
( b6 a( u. \1 J7 ~5 c! P Via Pads Layer 1 TO Via Pads Layer 1
$ z, k/ _3 t5 h$ Q No Hazards.
3 Q7 M! a6 Z3 Z% e- s& e. l3 V9 w# e0 X) R5 z2 ]- {; [6 R9 W0 Y
Via Pads Layer 1 TO Via Holes Layer 1
9 }7 S) `$ u1 Y$ }# @ No Hazards., Y/ V' n, a6 M: ~1 \8 M7 A4 R
( g: ] o7 Q/ q: X8 k' j2 k4 v Via Holes Layer 1 TO Via Holes Layer 1& F/ c. j! V; V
No Hazards.
* L7 T+ q4 o: ?+ C% W9 p% ]7 u3 T+ ~1 U& t
Traces Layer 2 TO Traces Layer 2
+ w" G. n" d( V# {/ L/ A No Hazards.
( P, c6 d' L E( i
; _: q8 i% _" n" F Traces Layer 2 TO Part Pads SMD Layer 2" Y" F& @3 v+ }/ t8 O8 h7 G) r& V
No Hazards.
6 r2 m" p. r* ^2 b
% O8 H+ @3 J l Traces Layer 2 TO Part Pads Thru Layer 2
6 [3 z% b& M( B1 h* K No Hazards.
7 o$ q1 w! n+ E- C% b% W- M! y2 q, [5 G/ p' a. C
Traces Layer 2 TO Part Holes Layer 2& [! ]# O3 R; n$ z6 |
No Hazards.3 G' u- \& Z# _& a+ E
/ n- t5 s! w/ Y3 U2 c
Traces Layer 2 TO Via Pads Layer 2
3 _7 W6 f4 [) D2 C4 X No Hazards.: n/ [" i# h4 D8 v
7 h% v4 s* e. f9 B' Q+ a) {# J Traces Layer 2 TO Via Holes Layer 2( |4 z3 {+ s- e a) z8 B
No Hazards./ n; g0 z6 v5 k9 E2 u. E9 U: T, Q
6 q9 P8 S5 x3 f9 M
Part Pads SMD Layer 2 TO Part Pads SMD Layer 20 g2 `3 D% h7 {' C
No Hazards.
( |, j V! `' P- o# S2 C" E8 H7 O, h: O0 _ y
Part Pads SMD Layer 2 TO Part Pads Thru Layer 2) B, Z" [0 e+ S! a) z
No Hazards.
! U1 w8 A" {- F! P2 p" v ~- M% i6 x' ?! @2 |1 @4 F* P
Part Pads SMD Layer 2 TO Part Holes Layer 2
7 Z2 ?/ m: O! o2 _2 Y No Hazards./ M0 M4 o4 p9 q
/ m2 A6 `* G4 K7 } Part Pads SMD Layer 2 TO Via Pads Layer 2
# L) H7 D+ ?( R8 E No Hazards.
" e, K0 y0 [% L. I' c8 c5 [( U% j2 W7 D. D! U, l" o& m& J
Part Pads SMD Layer 2 TO Via Holes Layer 2# E* [3 u( `/ f ~* {4 `
No Hazards.8 V9 S* T+ `' f$ c8 v9 ]
! |7 [4 F# F' ^
Part Pads Thru Layer 2 TO Part Pads Thru Layer 2
. ?: {; M7 [( L$ c2 B No Hazards.
2 I/ \" \0 c5 s% G* c& z- F% ]2 n; p
Part Pads Thru Layer 2 TO Part Holes Layer 26 p! O( l1 X- g/ a8 _7 a
No Hazards.
% F* [3 Z! V: t9 F0 S$ m) l
( B5 ]4 `4 s" [( r Part Pads Thru Layer 2 TO Via Pads Layer 2: A" s6 b7 W9 i" r
No Hazards.
: ~& ~- \( f. a" z6 v y j
3 p+ y$ Z: }( h8 G& I Part Pads Thru Layer 2 TO Via Holes Layer 2
; d9 M& w! P. f; U No Hazards.- X/ p. v& F& t, ^! ?: S/ G/ ^
1 s- x5 s/ e' S9 j) J Part Holes Layer 2 TO Via Pads Layer 2+ E4 B. v- }) J% J) _' g5 i
No Hazards.
8 V" C {) n0 `# o Q8 X, D( g5 h" D* ^+ U; X7 \4 U* \ t% ?4 |3 O# d
Part Holes Layer 2 TO Via Holes Layer 2( B6 b9 X2 S# \
No Hazards.0 M- t+ @% [" Q1 @8 R( X# {1 e
( {- j& l4 Y" D0 k# V- G5 Z' G Via Pads Layer 2 TO Via Pads Layer 2
9 q. G/ r) ^% w9 r. T No Hazards.- v/ g$ `' @) z
0 w) R" e/ C* R
Via Pads Layer 2 TO Via Holes Layer 2* ]3 v! t7 a8 W& i0 D
No Hazards. F' F+ J. k' `6 v8 f* R2 x
1 [0 _. p3 p$ r9 [/ x1 V
Via Holes Layer 2 TO Via Holes Layer 22 F9 S! R. x/ ]* v, t* c# Z8 h0 L
No Hazards.; u! A0 R: e0 o+ M7 w
: o0 e+ T) }. s1 C
0 ?6 k; r+ ]3 G Total Hazards Found : 4" y% _- }6 e& x; K0 ?0 |4 O/ a# W
9 N1 ?1 n4 C. |% t, p& l8 g
! |. S6 r$ w2 Q" V
' t) F2 U$ e1 b" v, ~( l
0 O. R4 ]2 p, P; B) z( \- [1 q Planes Clearances And Rules7 T, J" H- z. u) s4 G
---------------------------
+ x3 L4 X0 s& n1 [8 |, O) F
( c4 l& j5 U7 l" ?5 i: i- Z9 ]: M* B) T Positive Planes Layer 1 TO Part Pads SMD Layer 1
5 X5 K- S8 u7 p$ ]7 M. x7 X: a No Hazards.
( l' h+ C# W& v5 L0 C/ `/ V! c9 F, z3 s2 }
Positive Planes Layer 1 TO Part Pads Thru Layer 1" g- B! Y; u5 s7 }" N$ ^$ P5 d
No Hazards.
2 g4 A4 c q7 X" R9 R1 s( x1 `1 I6 Z. k, E
Positive Planes Layer 1 TO Part Holes Layer 1
* R9 a. m7 e0 U( Y# u No Hazards.
4 n3 s9 r! y0 M$ }) U* g; ^. t; s# {! b: m: b" b: N
Positive Planes Layer 1 TO Positive Planes Layer 1( Y9 Z6 }5 K& ^$ e
No Hazards.. d* A& p& w' @0 p3 s/ o
- p3 z8 z; _7 c Positive Planes Layer 1 TO Route Border" N6 G9 X, N/ A( h
No Hazards.
0 r" \3 A% B/ T6 S4 R6 @" S% }* t$ d I; G$ r7 f5 Z, N
Positive Planes Layer 1 TO Traces Layer 1
; S2 b6 t9 @4 D4 O0 ? No Hazards.
$ S+ F6 N/ f3 X. s2 |
* Y; f, B1 L8 m) O$ _ Positive Planes Layer 1 TO Via Pads Layer 10 l4 E1 K5 S1 J5 s
No Hazards.
! }) j% p* }$ T0 |9 H. w
. M7 t) }8 `4 A4 Y Positive Planes Layer 1 TO Via Holes Layer 1
& B8 W% Q6 K/ v7 h0 U No Hazards.
# m/ @1 w8 }) Z: i E+ P7 D2 P$ H: A; w( t$ k
Positive Planes Layer 2 TO Part Pads SMD Layer 2+ z, g2 k9 W1 |7 u) T+ m8 u
No Hazards.
4 Y' y" e- v, B/ e) ~* f7 R6 e: [/ Y0 u: l, g' O
Positive Planes Layer 2 TO Part Pads Thru Layer 2; e' {- h: M5 i; A
No Hazards.
; n* B5 E* n6 x7 i
3 w0 O6 P& }, y K2 T. V7 K Positive Planes Layer 2 TO Part Holes Layer 23 d+ |2 Y6 B& _ B
No Hazards.+ d0 G% p8 f0 S) }
+ N d6 i( \* Q, w
Positive Planes Layer 2 TO Route Border" ~; c/ J$ P' t* G( c
No Hazards.
$ K) R# ?5 s& S9 u" k. F
1 J9 d: E. E: P' ]' R+ W Positive Planes Layer 2 TO Traces Layer 28 n, P3 W3 s: W
No Hazards.
( O( p4 @$ ]5 J" J% w0 @! b U; s
5 x* k" b+ |2 }. P, I+ I" ]1 a Positive Planes Layer 2 TO Via Pads Layer 2
: G$ m! C9 D3 Z% H) x' H. \: n' C No Hazards.% |3 w! I" f5 R+ l( k$ h, {4 Z
! S# H: n0 t3 o) a' w3 N
Positive Planes Layer 2 TO Via Holes Layer 2
: S! b/ L+ p" V# X: O5 C No Hazards.
" u! v/ s' z+ p' L3 f# _+ b4 m; Y2 I6 ]8 l. B' w: ~9 l+ R* k9 D
: K# Z8 g# |( m6 Z' h6 S% u
Total Hazards Found : 0
0 X) [5 T. `! y/ c- M4 ^, J5 P, _
0 \) `( }% z/ e4 w
* H h. {6 g9 v$ C- \& M% R
2 v# t- T# Z2 a8 ~$ T* ] Non-Net Class Element To Element Clearances And Rules
' |# @* l8 M& m: V4 ?5 l7 H* l ----------------------------------------------------- b- ` |, Q( ^
/ U; W* K) U/ |5 i Route Border TO Via Pads Layer 1 Clearance: 0mm. a6 k; k- {1 g8 d0 w
No Hazards.
" t4 X: K; L& t: x* Z8 o
% b& g& R t0 m. Z5 n( ?& R. r Route Border TO Traces Layer 1 Clearance: 0mm
- }% Y1 n6 N; \/ r3 _& d No Hazards.
- \* S+ t7 F# x; o$ J
0 \5 P) H$ `5 i+ N' K Part Pads SMD Layer 1 TO Route Border Clearance: 0mm
2 Y4 e* u( u0 @: e No Hazards.0 m( }2 V! x4 k
, [' L$ ^/ a+ u1 O2 N+ T# y Part Pads Thru Layer 1 TO Route Border Clearance: 0mm, x% {( H- L2 L8 x- R
No Hazards.
, B' c0 j' R) f& |$ E3 }. ?, | v7 s1 P4 T, ~/ i$ ?2 M
Board Outline TO Part Pads Thru Layer 1 Clearance: 0mm
0 Z+ h( ]- z! d2 ^ No Hazards.
7 T. y" Z' h- N7 S; X$ p+ x o+ a; R
Board Outline TO Via Holes Layer 1 Clearance: 0mm. L4 u) T$ P- }9 \1 x/ u# ?
No Hazards.
: t5 E. N7 i2 s! d
Z$ v. W- e$ D- M4 y b/ B% D Board Outline TO Via Pads Layer 1 Clearance: 0mm
0 m! h/ d; q/ @- { No Hazards.
8 S) B5 n2 q; P I( K2 x
% v7 ^* D: d, U9 b- H Board Outline TO Part Holes Layer 1 Clearance: 0mm" v% E- n# A0 N# m) ^, s3 A+ N
No Hazards.
, [4 {/ d5 s3 [4 I
$ x, h, ?2 t! b >> Board Outline TO Placement Outlines Top Clearance: 0.15mm
3 J% }6 a$ H/ b Hazards Found : 2: l1 C# v+ h7 J5 F
: F1 v/ Z# J$ K- i( u. [1 z& u$ [ @" _! y
Board Outline TO Part Pads SMD Layer 1 Clearance: 0mm- ?9 I V; e1 U/ o$ V
No Hazards.* W% H/ J) D( `# `) F3 i' o
( e" Y) u8 _+ U. F8 Q
Board Outline TO Traces Layer 1 Clearance: 0mm
. T8 [- t3 F- n$ j2 h( Q+ H0 x No Hazards.; p4 D6 ~& N3 \, v: x
+ y; K9 ~: b) p8 ^) K3 v2 D Route Border TO Via Pads Layer 2 Clearance: 0mm
$ h, d; Z/ N0 F( g& E6 i No Hazards.1 S w% o% l: R+ s6 \
. q, Q; }5 X% b8 ~* I
Route Border TO Traces Layer 2 Clearance: 0mm
: z7 i5 z5 q- i% E5 V7 V No Hazards.
; _% P# C+ k8 F% _* a7 q8 q" D* ]* k8 l
Part Pads SMD Layer 2 TO Route Border Clearance: 0mm# Q; V( f; [; O* ]6 N' h+ Z. c0 d
No Hazards.. W( R1 m! `! `7 |) s6 _
9 t% Y; `6 Y% O2 Q* F" v1 j+ g
Part Pads Thru Layer 2 TO Route Border Clearance: 0mm
\8 b4 Z. R) {9 P9 Q q No Hazards.
# ?/ ~' B, y9 \2 M7 C, d- M8 f5 U3 G& d% c+ f, J- D& D
Board Outline TO Part Pads Thru Layer 2 Clearance: 0mm) U9 F# p4 D5 ]$ i8 ~" `
No Hazards.3 t) k9 J2 Y- I, N" `7 b3 C
* K8 @7 a6 X, Q Board Outline TO Via Holes Layer 2 Clearance: 0mm
: U( T% n& b( F No Hazards.
4 b6 d* i$ {- C, [
4 w6 T s7 u8 j, W Board Outline TO Via Pads Layer 2 Clearance: 0mm
6 [% @( e7 g+ F- y$ j0 n$ Z1 g* m" P No Hazards.
- X( j0 A1 b3 s* d: A* R; b* K2 ?! ~9 h) o
Board Outline TO Part Holes Layer 2 Clearance: 0mm
9 B1 f9 `. c* |* J No Hazards.: K1 W* g4 _+ F0 k3 t
4 `! T( m7 j7 k# z+ }3 X( r Board Outline TO Placement Outlines Bottom Clearance: 0.15mm
' U1 ~$ Y+ g2 K# A9 S3 H. s No Hazards./ k5 s6 X2 p, X8 ?
8 [" h* D2 Q- u- q
Board Outline TO Part Pads SMD Layer 2 Clearance: 0mm
+ v; Y$ f K% f" v5 y2 Q No Hazards.
- Q) r8 W; I, i
3 K! N2 W9 `! y+ x4 o Board Outline TO Traces Layer 2 Clearance: 0mm$ b( S4 X7 x) b% u0 W: J
No Hazards.
5 m$ q H9 n* Y4 {$ \
" i3 y. P7 P4 x0 H
* w( U! j( f% f" ]7 P Total Hazards Found : 2& f ]4 O# k; I/ Q; I+ y/ y
, u0 ~% ?" p. O
) W% c$ y4 M! Z& M2 ?$ p4 Z" \+ @
Total Proximity Hazards Found : 6
* w( E' O0 g- F% s+ U1 M# M, y" Z) r& K# r1 J2 n- E% Z. {
) N! h/ S% B: n3 V% I, u3 @8 ~7 S, R* N& X
" l [- {1 g0 Z; S$ s ----------------------------3 I- q* B& x2 }- r% d3 I
CONNECTIVITY & SPECIAL RULES
; ^2 p6 K0 G+ |0 a) q L2 J+ J ----------------------------
+ g+ o0 w3 C+ f9 `5 e2 M% Y" t# Z' x; }
9 W1 j$ s6 ]' M5 d
Check For Unplaced Parts : YES
- J7 U+ r* L Q* r" _0 y: }. a No Hazards.
0 j* A/ F7 _5 m) k( R/ H$ k) K) D x" k
) D. }$ l- v' Q1 s1 m Check For Missing Parts : YES
. A9 \' \- P4 u2 y/ Q No Hazards.
6 }1 S0 Y \5 n
% E+ Z3 ~. C4 u+ u9 X
4 |% c/ {0 u/ O8 v+ n K, X# a% w Check Trace Hangers : YES
2 x( A9 ^: m# U2 e7 ~9 L No Hazards. j; x8 T0 h2 C4 ^5 c5 ]
4 H9 ~4 @4 A2 q9 T" P
" t9 f0 @0 K9 q0 r% F Check Trace Loops : YES
2 i1 J" q9 e* T7 a2 `+ a No Hazards. g$ `3 \+ n/ i" \; ]8 @6 I* ]
% c5 b# y- p) G* F, t
( e! ]$ H; _3 Q: q& l; w8 e
Check Trace Widths : YES
4 }% d: q6 O+ O* N0 z/ a Hazards Found : 122) f d2 Q' |5 ^4 m
1 U5 a! j {% G( L% c# z
# y- h+ q! a d- {$ h d; \, z Check Single Point Nets : YES" B) ?0 u- N, C+ m
Hazards Found : 1
6 V+ t; g8 J( a1 \! P2 W4 i; A' P- Q9 z) ]6 i
8 c K, `9 v" o; G2 t Check NonPlane Unrouted/Partially Routed Nets : YES% y* }; W# Y2 t0 |/ d' @9 Q% q C
No Hazards.8 i3 c' m5 x! e: ^
$ ]; z& l- G; y- J8 X5 p3 x
8 C) s& D% t% G% o- f Check Plane Unrouted/Partial Routed Nets : YES
: N; E. b4 {3 z2 K; n No Hazards.
% |; P. a4 ?* G2 D
8 b: z/ I1 ?4 C) `. U1 T$ i2 t! ~/ M1 n
Check Routed Plane Pins : YES
3 g) {0 I4 n0 [ No Hazards./ a' p9 _( l# G& F
# ~8 Z3 L. ?5 u0 _8 {1 T/ E% u
. o8 ?% M* I8 M% Z0 V% t Check Plane Islands : YES
: b) Z, t; U# P$ o7 s W3 k: w No Hazards.3 {' n& h1 [& w
% j+ K; p! E9 T( H
1 d' c0 D$ f. f
Check Dangling Vias/Jumpers : YES" G7 C. L6 o( x5 E8 S! n% m
No Hazards.
: K/ d. B4 N4 o* \$ u' j ]5 G" I% j
0 Z: S2 w+ `( L. r8 Y. F7 W) H
Check Unrouted Pins : YES" j4 L' ]7 @9 E" ~4 ?! q( E* c3 {
No Hazards.& c' l8 B/ [/ C/ K9 n+ D9 w
# D+ |2 h) f( o, Y( A
4 R& c! q/ a8 l; R& t8 Q% K Check Routed Non-Plated Pins : YES$ n& }9 p! k! R' h
No Hazards.
/ C1 t; B5 J, U, ]5 i* A
: x0 u: E3 h4 ]: J- ]& Q2 I: _- E) T/ R: @& V
Check Minimum Annular Ring : NO1 j! d/ ~0 l' l; E$ s7 Z
. ^( q R2 O, l! D& o6 r
# h, J4 V7 ~; m" Z. Y# N Check For Vias Under SMD Pads : YES
( l& ]) ~- f, F% X2 z; {1 j8 ^! k No Hazards.
) z) U1 C" G% O4 f4 L8 f3 k R# j# {& {# E1 L
# K. a: V% s4 ?% {* _& T5 { Check For Vias Under Top Place Outlines : YES; ?' W: u# f0 ^3 [& z& R
Hazards Found : 521 N2 R' E I) S* V
, Z3 ?% ~ f# ^5 {1 B ^; E: O6 [9 F% q3 K2 V; [- f, S7 {2 Y
Check For Vias Under Bottom Place Outlines : YES% {7 w1 D3 X- J' X0 T( Z+ w# h
Hazards Found : 10
+ `( b" |" |- V2 o
! J+ \" R3 w% k% I; }; R5 z9 k
8 s2 ^; f+ ~+ ^. i" Y0 e9 p: O. Y* n Check For Missing Conductive Pads : NO
1 i4 y& [5 m- V3 J: g! ~- k. G9 x: Z
, V/ K/ n+ A9 M# v0 t7 W; l. G9 h [! a7 S0 u; L1 ^3 @
Check For Missing Part Soldermask Pads : NO9 a: R2 y6 e' H9 ]$ W
. B: t- h& X( K$ s4 ]' O+ V
+ N4 {9 `) n0 R4 [0 e/ N Check For Missing Via Soldermask Pads : NO
# P+ L7 M, |; s/ }/ w( q" l5 [; V+ l$ S% o. x4 z& {
( ~' e* S) t4 X/ U3 ` Check For Missing Solderpaste Pads : NO. v j, @4 S: k4 l
9 N3 e q1 w; N5 T. F! Q/ V; w2 ~2 Y& t, Y0 ^* s( T" P
' J* g% }1 w: j9 A8 ]0 S- w' ?
Total Connectivity/SpecialRules Hazards Found : 185
$ ?8 o K4 x% j3 k) Y" C% ?- N$ W
Y. z. e% H1 {# Q" Q! F
n: T2 s/ F) G ====================================================================0 J( a, _3 U; s
5 F# M& d' F r6 b- m" p4 |1 G7 w" a6 s0 Y
+ u' g( m, k1 b; c* w
Total DRC Hazards Found : 191
2 C* @5 \3 E, K2 N' h# {
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2 f; l( ~3 c& X' l7 j, G8 z/ E2 ] 08:00 AM Tuesday, September 09, 2008
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r9 M( m9 P& T- p# G6 _; O) w5 v以上是我做的板子的DRC结果,
( V# C1 R5 d0 C Check For Vias Under Top Place Outlines : YES
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Check For Vias Under Bottom Place Outlines : YES$ m$ X L0 k1 t, ^. W4 F) ?
Hazards Found : 10
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其中元件的放置框内打孔有报错,怎么能让它不报错呢? |
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