Via Current Carrying Capacity?

karpcb15

Hi all,
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I am doing substrate with 4 layers , used Blind vias (L1 - L2 and L3-L4) and Buried  core Via (L2-L3)
" i! _) [, r- j8 N3 p2 WBlind via size 60 um drill / 100um pad , Via length 40um
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Buried Core via size 100um drill / 200um pad , via length 150um
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Anyone knows the Current carrying capacity of above mentioned blind and buried core via ?
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$ K4 F$ T" m* `" H5 y9 fWhat is the general Via wall thickness in substrate?

Thanks in Advance
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EDNA

自己计算下，这种激光孔，是实心铜。

karpcb15

EDNA 发表于 2019-1-14 10:01
0 B9 ^3 ?( y; ]  g5 n8 Z3 w自己计算下，这种激光孔，是实心铜。

如果通过填充铜，我可以知道通孔电流密度
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tencome

直接按照圆柱体的实体铜计算过电流能力就行了。　　

gochip

怎么算