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*.GTL TopLayer顶层走线, L) F9 S1 }* F/ ^: f/ Z! l
*.GBL BottomLayer底层走线
( B6 E3 E2 _0 q0 I3 c# h *.GTO TopOverlay顶层丝印字: z) i. |: E, Y
*.GBO BottomOverlay底层丝印8 H: [* P- ]* e$ `$ ?5 p' k) Y
*.GTS TopSolder顶层阻焊7 H4 Y# y/ y. @; t
*.GBS BottomSolder底层阻焊
C! s: B! U6 j q8 t& z* ^* O *.GTP TopPaste顶层贴片钢网
2 P0 Y' N4 t6 D1 C *.GBP BottomPaste底层贴片钢网
0 E! _. P" V% u *.GPT Top Pad Master顶层主焊盘
# E0 |& m. h" u4 C" E *.GPB Bottom Pad Master底层主焊盘
& G. O: B- C% y6 K2 k *.G1,*.G2,.. MidLayer1,2,..内层走线+ n& ~2 K/ m3 q
*.GP1,*.GP2,.. InternalPlane1,2,..内层平面1,2,... W+ \. W; r% f5 z, m. k; F( w. T
*.GM1 ,*GM2,.. Mechanical1,2,..机械层1,2,... x% g4 Q) o: [4 r9 c# V
*.GKO KeepOutLayer禁止布线层(可做板子外形)& _5 ~9 r7 f: c: g d( d
*.GG1 DrillGuide钻孔位置层
! U7 V$ M6 S5 @! a1 c, ^9 b *.GD1 DrillDrawing钻孔图层 *drill 钻孔文件5 G& \* g0 Z3 R' ]
*.TXT 分孔图表
: ~2 X: y* R, ~+ h% M *.APR 光圈表文件
6 c5 ]4 V( c2 _0 }2 K *.DRR 钻孔报告文件" ?, F0 H% A0 Z7 E
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