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［书籍］Digital Techniques for High-Speed Design, h! S }5 z9 ~6 ] L! W
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DJvu格式,共67分卷,压缩文件里有DJvu浏览器.) g& c5 {* L! B. E: I: r* k
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目录& o& M4 s! ?; o2 w
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I. INTRODUCTION. ! d+ ^/ |: y! }) S2 N
1. Trends in High-Speed Design.
T& ~/ p. O: m. r" B1 Z2. ASICs, Backplane Configurations, and SerDes Technology.
1 l: K& q: ^" p; w3 ]3. A Few Basics on Signal Integrity. 3 w F6 v" C3 y/ k8 ^2 P
+ f4 V; R# i% H, M: z/ E( HII. SIGNALING TECHNOLOGIES AND DEVICES.
* F& k/ t. g. w2 L4. Gunning Transceiver Logic (GTL, GTLP, GTL+, AGTL+). 3 b& [6 I: B" ?. N; S/ F
5. Low Voltage Differential Signaling (LVDS).
, I3 `* r/ ^" P ^0 `7 o5 {6. Bus LVDS (BLVDS), LVDS Multipoint (LVDM), and Multipoint LVDS (M-LVDS).
7 {; B2 _3 A8 Q$ H g/ Y- X7. High-Speed Transceiver Logic (HSTL) and Stub-Series Terminated Logic (SSTL). ( l1 q+ B- ?+ v. e2 n( \
8. Emitter Coupled Logic (ECL, PECL, LVPECL, ECLinPS Lite and Plus, SiGe, ECL Pro, GigaPro and GigaComm). 3 A( C; ^1 ]$ @1 z
9. Current-Mode Logic (CML).
& u7 H# K/ s- E2 P10. FPGAs - 3.125 Gbps RocketIOs and HardCopy Devices. 8 J9 L; u5 L# G y: v
11. Fiber-Optic Components.
. D( h8 k0 }; Z- @! ^12. High-Speed Interconnects and Cabling.
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( X' r0 z% n# J+ ZIII. HIGH-SPEED MEMORY AND MEMORY INTERFACES. # t6 u4 e2 d* D* T( }$ U* ^& E
13. Memory Device Overview and Memory Signaling Technologies. 7 g/ G! D) T. K, [$ N* ^5 g! ^
14. Double Data Rate SDRAM (DDR, DDR2) and SPICE Simulation.
( C5 }1 J" U! L6 a. O15. GDDR3, ZBT, FCRAM, SigmaRAM, RLDRAM, DDR SRAM, Flash, FeRAM, and MRAM.
' K- X3 k- ?7 o+ N" f8 R! f. J; s4 H- `16. Quad Data Rate (QDR, QDRII) SRAM.
+ {3 g% {. T0 V, A17. Direct Rambus DRAM (DRDRAM). 2 T; x. ]: {1 P7 [
18. Xtreme Data Rate (XDR) DRAM, FlexPhase and ODR.
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IV. MODELING, SIMULATION, AND EDA TOOLS.
% f y* t W. ?- x. _+ g' ~19. Differential and Mixed-Mode S?Parameters. $ p9 H( r) ?. y+ a/ i+ m N
20. Time Domain Reflectometry (TDR), Time Domain Transmission (TDT), and VNAs. * I3 B. @" {0 W5 Q
21. Modeling with IBIS. 4 h) A& r$ v/ i5 P7 `+ C s3 @7 R
22. mentor Graphics - EDA Tools for High-Speed Design, Simulation, Verification, and Layout. ; M5 R- i" p" x
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V. DESIGN conceptS AND EXAMPLES.
1 g9 ]8 X/ ]/ Y0 D- L( s4 }23. Advances in Design, Modeling, Simulation, and Measurement Validation of High-Performance Board-to-Board 5-to-10 Gbps Interconnects. & b" u3 J0 a0 @8 i' @# L
* s1 L/ J" P$ B3 X9 ]Appendix 23A. Generalized N-Port, Mixed-Mode S-Parameters. " T! G. R! q4 @- u6 B2 ?0 |
24. IBIS Modeling and Simulation of High-Speed Fiber-Optic Transceivers. ) _' Y, u- M/ r9 o4 q$ X6 `
25. Designing with LVDS. 4 j& r2 ^* J' L9 A7 a' Z3 M
26. Designing to 10 Gbps Using SerDes Transceivers, Serializers, and Deserializers.
% c" M. H& k ~+ E T7 {27. WarpLink SerDes System Design Example. - y" e+ c. Q* k( R" @" ]4 f! G6 p
; ?7 p+ p/ i0 c6 h1 H% {VI. EMERGING PROTOCOLS AND TECHNOLOGIES. 5 e4 I+ W P! K; e2 l) n
28. Electrical Optical Circuit Board (EOCB). 3 H* k* ^. H/ v' D) V7 ^
29. RapidIO.
, z& s* A% M _3 i30. PCI Express and ExpressCard. 7 B1 v" I' u- s1 A
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VII. LAB AND TEST INSTRUMENTATION. 6 ?* r% b s. o$ ]6 {, z
31. Electrical and Optical Test Equipment.
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[ 本帖最后由 snowwolfe 于 2008-7-30 13:53 编辑 ] |
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