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[书籍]Digital Techniques for High-Speed Design2 `% [6 H/ X7 M m7 \2 ]
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目录- D, z% N' m, U2 C! B( f
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I. INTRODUCTION. ' u0 v4 O+ s% {$ H; ^! c, E7 W" k
1. Trends in High-Speed Design. 1 A! K$ e( o' p; d
2. ASICs, Backplane Configurations, and SerDes Technology. . @$ E8 z) l- ~2 m/ @0 u
3. A Few Basics on Signal Integrity. 8 t4 D. N. b% J; H, f- U
% O# H0 C( J5 w" u$ t' ?( r% Q* R) H& JII. SIGNALING TECHNOLOGIES AND DEVICES.
: ]; }7 ^; w- J4 \& S2 D; }0 @- G4. Gunning Transceiver Logic (GTL, GTLP, GTL+, AGTL+). / R2 J. d- {% Y" ]# L4 V
5. Low Voltage Differential Signaling (LVDS). : Z) y# v7 i7 x; u2 e5 b9 _
6. Bus LVDS (BLVDS), LVDS Multipoint (LVDM), and Multipoint LVDS (M-LVDS).
9 `# z" \) q2 v6 Y7 f7. High-Speed Transceiver Logic (HSTL) and Stub-Series Terminated Logic (SSTL). $ R/ A) {1 v+ _8 j
8. Emitter Coupled Logic (ECL, PECL, LVPECL, ECLinPS Lite and Plus, SiGe, ECL Pro, GigaPro and GigaComm).
! E/ E6 |2 T4 F6 d. O$ ?9. Current-Mode Logic (CML). 6 ^9 s4 V* h: h- Q, n$ j
10. FPGAs - 3.125 Gbps RocketIOs and HardCopy Devices.
/ z* t! o9 w# A11. Fiber-Optic Components.
4 Y+ n! D) r: W! b1 L. l12. High-Speed Interconnects and Cabling. t4 |5 [1 S/ y& Q# U0 j
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III. HIGH-SPEED MEMORY AND MEMORY INTERFACES.
; G! p* z0 {" P8 O1 |* c13. Memory Device Overview and Memory Signaling Technologies. 7 r' z5 a' |; n1 ~# d
14. Double Data Rate SDRAM (DDR, DDR2) and SPICE Simulation.
5 { w E# P, }( H S2 B6 U( ]15. GDDR3, ZBT, FCRAM, SigmaRAM, RLDRAM, DDR SRAM, Flash, FeRAM, and MRAM.
* i4 P- r* S% ]/ A( l16. Quad Data Rate (QDR, QDRII) SRAM. 0 V4 O: H ]. p; A+ d! `7 J% ^
17. Direct Rambus DRAM (DRDRAM).
% V8 C4 D w, E; m6 t* t. N8 \18. Xtreme Data Rate (XDR) DRAM, FlexPhase and ODR.
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IV. MODELING, SIMULATION, AND EDA TOOLS. : z$ s, \: N& O% q
19. Differential and Mixed-Mode S?Parameters.
. U; I. s- W6 N2 c" g1 k6 X, I, A20. Time Domain Reflectometry (TDR), Time Domain Transmission (TDT), and VNAs. ' ?3 }( f$ \* a; I
21. Modeling with IBIS. ) A' x/ a9 i- G
22. mentor Graphics - EDA Tools for High-Speed Design, Simulation, Verification, and Layout. + g2 l: K4 a# V7 B, G% q; x
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V. DESIGN conceptS AND EXAMPLES.
! E" Z! }$ V( ~# v, }: s23. Advances in Design, Modeling, Simulation, and Measurement Validation of High-Performance Board-to-Board 5-to-10 Gbps Interconnects. , T7 k: y3 i' s% K+ R; ?
" Q0 e( k: Q9 s7 m! Z* TAppendix 23A. Generalized N-Port, Mixed-Mode S-Parameters.
^6 I4 ^9 Z( F$ X2 I: ?24. IBIS Modeling and Simulation of High-Speed Fiber-Optic Transceivers.
/ b* P# ?$ ^/ P; [, _* c& P25. Designing with LVDS. 6 b7 r1 F. p8 W4 G
26. Designing to 10 Gbps Using SerDes Transceivers, Serializers, and Deserializers. , _( \6 W$ L& A& X* R* r- m
27. WarpLink SerDes System Design Example. 1 _4 }6 g+ ^' L6 k* e
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VI. EMERGING PROTOCOLS AND TECHNOLOGIES. . j6 J* P5 V% T3 A+ F9 F
28. Electrical Optical Circuit Board (EOCB).
5 D$ e/ Z2 s: ~29. RapidIO. & e7 Z9 O9 m% I, A2 O
30. PCI Express and ExpressCard. - s* v- v+ K$ P; w/ @
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VII. LAB AND TEST INSTRUMENTATION. $ `# p3 ]0 O2 Q4 O; a% ?2 G
31. Electrical and Optical Test Equipment.
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* K& q. U6 F. {/ a$ f# x8 D: L[ 本帖最后由 snowwolfe 于 2008-7-30 13:53 编辑 ] |
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