[allegro16.2][2层] AT91SAM9N12-EK 官方评估板DM_REVB（TSM+QT1070+LR043JC211）...

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' p. K' }6 Y, H4 E9 S[allegro16.2][2层] AT91SAM9N12-EK 官方评估板DM_REVB（TSM+QT1070+LR043JC211）pcb文件 文件描述： ) D; g/ n, ?% F$ @4 Y5 i: C1. 作品用途： AT91SAM9N12-EK 官方评估板DM_REVB 2. 软件版本：allegro16.2 3. 层数：2层 ( Y  U3 y' s; o) h5 T4. 用到的主要芯片：TSM+QT1070+LR043JC211 4 _+ L  l" q  ^+ i0 A0 n5. pcb尺寸： 5309*2749 MIL + n, V+ D4 X( W! i作品截图如下： 6 K5 r; Q1 j0 L2 \ 底层截图： # t% q, i/ \( Y; ?( {全层截图： ) `) x& Z) Q: H! v& m! P( c; ? % b- c& Y: v+ r6 e+ V$ BBOM： Bill of Material Report (Condensed) SYM_NAME COMP_DEVICE_TYPE COMP_VALUE COMP_CLASS QUANTITY REFDES 名称 类型 属性 类别 数量 位号 4_8X4_8 L_SMT_4_8X4_8_22UH 22uH IC 1 L1 C0603 C0603_C0603_100N 100n IC 5 C11; C13; C20; C21;  C22 C0603 C0603_C0603_DNP DNP IC 4 C16; C17; C18; C19 C1206 C1206_C1206_10U 10u IC 3 C7; C10; C12 C1206 C1206_C1206_2.2U_10%  X5R 2.2u IC 2 C9; C15 CONN15X2_100_AUK_FVP75_2X15 TSW_2X15_DIP_RA_CONN15X2_100_AU TSM-115-01-L-DV-A IC 1 J2 CONN20X2_100_AUK_FVP75_2X20 BCS_2X20_DIP_RA_CONN20X2_100_AU TSM-120-01-L-DV-A IC 1 J3 FPC40 LR043JC211_0_FPC40_LR043JC211 LR043JC211 IC 1 J1 PAD KEY_PAD_KEY KEY IC 4 K1; K2; K3; K4 QT1070_QFN20 QT1070_QT1070_QFN20_QT1070 QT1070 IC 1 MN6 QT1070_SOIC14 QT1070_SOIC_QT1070_SOIC14_QT107 QT1070_SOIC IC 1 MN5 R0603 R0603_R0603_0R 0R IC 34 R5; R6; R19; R22;  R23; R43; R53; R54; R55; R56; R57; R58; R59; R60; R61; R62; R63; R76; R77;  R78; R79; R80; R81; R82; R83; R84; R85; R86; R87; R88; R89; R90; R91; R92 R0603 R0603_R0603_DNP DNP IC 2 R24; R42 R0603 R0603_R0603_10K 10k IC 2 R40; R75 R0603 R0603_R0603_7.5R 7.5R IC 1 R41 R0603 R0603_R0603_4.7K 4.7K IC 13 R44; R45; R64; R65;  R66; R67; R68; R69; R70; R71; R72; R73; R74 SM_6_SOT23_70H CP2122_0_SM_6_SOT23_70H_CP2123S CP2123ST-A1 IC 1 MN1 SOD-123 SCH_SOD-123_RB160M-60 RB160M-60 IC 1 D1 SOIC8-200MIL DS2433_SOIC8-200MIL_DS2433S DS2433S IC 1 MN2 SOT23-5 SPX3819_SOT23-5_SPX3819 SPX3819 IC 1 MN3

附件：
PCB文件如下：
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