[AD 10][2层]STM32F407ZET6开发板（NRF24L01+WM8978+LAN8720）原理图和PCB源文件

AustCor1

作品名：[AD 10][2层]STM32F407ZET6开发板（NRF24L01+WM8978+LAN8720）原理图和PCB源文件
" u  V9 O0 \9 G. f4 q" I# @/ ~
文件描述

4 }7 M3 i+ V  r) w5 A# g1. 作品用途：STM32F407ZET6开发板
9 T9 c/ k2 Z7 ^1 k
2. 软件版本：AD 10

3. 层数：2层板

4. 用到的主要芯片：NRF24L01+WM8978+LAN8720

9 Y. s0 D/ z+ k7 m" J5 ?5. PCB尺寸：120mm*100mm
) x; B( I3 C5 s" p3 q7 Y! _
: `7 {- x9 s7 _5 d- c
% d$ A5 A4 j+ a% m: h; G5 ~" z: j作品截图如下：
0 S; D! R/ u2 y
7 A7 N* S8 B: a  l, P( ~顶层截图：
# F/ z/ ~3 V. o; X

( P, O0 _4 {5 e& X底层截图：


* [; p; L' N3 h$ W: z1 c  r/ w全层截图：
/ y* P5 C# d# u8 Z; i& {
7 w5 t+ c& |0 k3 y' ~7 j) z
) u) F( v; ?# G, [( y8 F叠层信息截图如下：
) G9 F$ d" y% V: N8 [% P
9 u! r! l+ J3 S3 w" a0 {
2 F2 A- z* J  y6 L: DBOM：

Comment（属性）	Designator（位号）	Footprint（封装）	Quantity（数量）
BAT3V	BAT1	BATM	1
BEEP	BEEP1	BELL-5	1
HEADER 3X2	BOOT1, BOOT2, BOOT3, BOOT4, P1	HDR2X3	5
104	C1, C7, C8, C9, C12, C13, C14, C15, C16, C17, C18, C19, C20, C25, C26, C28, C34, C37, C38, C40, C41, C47, C48, C49, C50, C51, C52, C53, C54, C55, C56, C57, C60, C61, C63, C65, C66, C67, C68, C69, C73, C76, C77, C78, C85, C86, C87, C88, C89, C95	C0603	50
104P	C2	C0603	1
223	C3	C0603	1
10	C4, C5, C6, C46	C0603	4
225	C10, C11	C0603	2
6P	C29, C30	C0603	2
22P	C31, C32, C74, C75	C0603	4
106	C39	C0603	1
105	C79, C80, C81, C82, C83, C84	C0603	6
220U	C90, C91	EC6.3MM	2
220UF	C93	C0805	1
220U	C94	C0805	1
HEAD2	CAN1, CAN2	SIP2P2.54	2
4148	D1, D4, D5	SOD-123	3
POW	DC_IN1	DC002	1
LED2	DS1, DS2, DS3	SMDLED	3
HR911105	EARTHNET1	HR911105A	1
USB/CAN	J1	HDR2X3	1
CON3	J2, J3	SIP3P2.54	2
LED2	LED	LED0603	1
LSENS	LS1	SMDLED	1
MIC	MIC1	MIC1	1
SI2301	MOS1	SO-G3/C2.5	1
HEADER 4	P2	HDR1X4	1
HEADER 2_1	P3, P4, P5	HDR1X2	3
HEADER 2X2	P6	HDR2X2	1
HEAD2*22	P7, P8	HEAD2*22	2
HEADER 9X2	P9	HDR2X9	1
HEADER 16	P10	HDR1X16	1
PHONE_M	PHONE1, PHONE2	PHONE_ST	2
NPN	Q1, Q2, Q3	SOT-23R	3
PNP	Q4	SOT-23	1
10K	R1	0805	1
RES_4	R2	R0603	1
1M	R3	R0603	1
47K	R4, R59, R60	R0603	3
1K	R5, R6, R7, R12, R21, R23	R0603	6
10K	R8, R9, R11, R30, R31, R34, R36, R55, R66	R0603	9
0	R10, R27, R28, R56, R63, R64	R0603	6
10	R13, R19, R29	R0603	3
4.7K	R14, R18, R35, R40, R42, R44, R45, R46, R47, R48, R57	R0603	11
510	R15, R16, R17, R20, R24, R25, R67	R0603	7
0.	R22	R1206	1
1	R26	R0805	1
100K	R37	R0603	1
22	R38, R39	R0603	2
120	R41, R61	R0603	2
360	R43, R62	R0603	2
49.9	R49, R50, R51, R52, R53, R54	R0603	6
680	R58	R0603	1
KEY_M	S1	SWD3X6	1
KEY_M	S2, S3, S4, S5	KEY_M	4
SD CARD	SD_CARD1	SD2	1
CON4P	SWD	SIP4P2.54	1
TFT_LCD	TFTLCD1	DB2*17-4.3	1
PAD	TPAD1	ALIENTEK_PAD	1
STM32F407ZET6	U1	LQFP144	1
NRF24L01	U2	NRF24L01	1
CP2102	U3	QFN28	1
AMS1117	U4, U5	AMS1117	2
IS62WV51216	U6	TSOP44	1
MPU6050	U7	QFN24	1
HS0038	U8	HS0038	1
ATK-HC05	U9	HEAD6	1
DHT11	U10	DHT11	1
WM8978	U12	QFN32	1
MAX3485	U13	SOP-8	1
SN65HVD230D	U14	SOP-8	1
24C256	U15	SOP-8	1
W25X16	U16	SOIC-8	1
LAN8720	U17	QFN24	1
MAX3232	U18	SOP16M	1
USB5	USB, USB_S	MICRO USB2	2
USB5	USB_H	USBB3	1
32768K	XY2	XYDIP5	1
8M	XY3	XYDIP5	1
25M	XY4	XYDIP52	1

附件：

; S" u; u6 q+ M: m. p  d原理图和PCB源文件如下：
9 @4 H1 L& h: B

游客，如果您要查看本帖隐藏内容请回复

4 m) S$ }5 l7 b$ ?: P0 D. f