[AD 10][4层]物联网开发板硬件设计参考（STM32L475VGT6+LSM6DSL+HTS221）原理图和P...

ScottE369

作品名：[AD 10][4层]物联网开发板硬件设计参考（STM32L475VGT6+LSM6DSL+HTS221）原理图和PCB源文件

文件描述

& d4 {8 c8 g( K5 M& r; g1. 作品用途：物联网开发板硬件设计参考
5 N. b/ J5 \! z- q! T0 p1 M
2. 软件版本：AD 10
% w! M4 H3 {6 p3 G- \$ A, O( b; A
- x3 D- X6 v, W3. 层数：4层板

4. 用到的主要芯片：STM32L475VGT+LSM6DSL+HTS221

- u* s4 |5 Y/ N, _( j; x& g5. PCB尺寸：90mm*62mm
" z: ?& j  R, V" ?) B* W
8 K& X6 X9 U- ^" J5 M: @$ L9 j5 n7 N& l
作品截图如下：

+ o2 X/ o; n7 s$ p) |顶层截图：


底层截图：

, ?2 r* r# ?( M7 a7 L
全层截图：
/ l, Y- N$ |0 g* q
( P$ o) Y6 g  i5 t
叠层信息截图如下：
8 t) ~: O# S, V( P" K6 R
8 ^$ O+ b7 y7 ?* ?) G
BOM：
) z1 u! s$ K4 z5 g/ W  }

Comment（属性）	Designator（位号）	Footprint（封装）	Quantity（数量）
SW-PUSH-CMS_BLACK	B1	SWI_WEALTHMETAL_TD-0341_4P - BACK	1
SW-PUSH-CMS_BLUE	B2	SWI_WEALTHMETAL_TD-0341_4P - BLUE	1
100nF	C1, C3, C5, C7, C9, C10, C11, C12, C13, C17, C19, C20, C22, C23, C25, C26, C28, C29, C31, C32, C33, C34, C36, C42, C43, C44, C45, C47, C48, C54, C55, C57, C60, C61, C62, C63, C65, C73, C74	0402_CAP_NPOL	39
Not Fitted (8.2pF)	C2, C4	0402_CAP_NPOL	2
1uF	C6, C8, C24, C56, C59, C64, C68	0402_CAP_NPOL	7
5.1pF	C14, C15	0402_CAP_NPOL	2
10uF	C16, C38, C39, C40, C41, C46, C49, C50	0603_CAP_NPOL	8
4.7uF	C18, C21, C30, C66	0603_CAP_NPOL	4
2.2uF	C27, C75, C76	0603_CAP_NPOL	3
10pF	C35, C37, C51, C52, C53, C71	0402_CAP_NPOL	6
10nF	C58	0402_CAP_NPOL	1
100pF	C67	0402_CAP_NPOL	1
Not Fitted	C69, C70, C72	0402_CAP_NPOL	3
Header 10X1_Female_SMD	CN1	F-V50XC-1X10R-LF	1
Header 8X1_Female_SMD	CN2, CN3	F-V50XC-1X08R-LF	2
Header 6X1_Female_SMD	CN4	F-V50XC-1X06R-LF	1
TC2050-IDC-NL	CN5	CON_TAG-C_TC2050-IDC-NL	1
header 2 pins 2.54mm	CN6	CON_SAMTEC_TSW-102-07-G-S	1
1050170001	CN7	CON_USBMICROB_MOLEX_105017-0001_H2P90	1
Header 4 pins	CN8	CON_SAMTEC_TSW-104-07-G-S	1
475900001	CN9	CON_USBMICROAB_MOLEX_47590-0001_H3	1
HEADER_2X6_PMOD	CN10	Header F 2x6x2.54 TH H PMOD	1
Comment	CN26, CN27, CN28, CN29	Spacer+Nut M3	4
BAT60JFILM	D2, D3, D4, D5	DIO_SOD323	4
HEADER_2X5	JP4	Header M 2x5x2.54 TH V	1
Jumper_2.54mm	JP5, JP6, JP7, JP8	CON_SAMTEC_TSW-102-07-G-S	4
FCM1608KF-601T03	L1	0603L	1
742792042	L2	0603L	1
LED	LD1, LD2, LD5, LD9	0603_LED_GREEN	4
LED	LD3	0603_LED_Yellow	1
LED	LD4	0603_LED_Blue	1
LD_BICOLOR_CMS	LD6	LED_BI-GR_HSMF-A201-A00J1	1
LED	LD7, LD8	0603_LED_RED	2
Comment	Logo_ST	LOGO_ST_Size3	1
BT Module	M1	SPBTLE-RF	1
ISM43362-M3G-L44	M2	ISM43362-M3G-L44	1
SPSGRF	M3	SPSGRF	1
BSR14	Q1, Q2	SOT23-3	2
30K	R1	0402_RES	1
0R	R2, R6, R12, R13, R42, R43	0402_RES	6
1K	R3, R18, R19, R21, R24, R52, R56	0402_RES	7
20K	R4	0402_RES	1
Not Fitted (0R)	R5, R7, R30	0402_RES	3
2K2	R8, R9, R10, R11, R53	0402_RES	5
10K	R14, R15, R16, R31, R48, R51, R67	0402_RES	7
330R	R20, R25, R44, R47, R55	0402_RES	5
680R	R22	0402_RES	1
100K	R23, R29, R49, R54, R59	0402_RES	5
47K	R26, R57, R58, R62	0402_RES	4
4K7	R27, R40, R41	0402_RES	3
2K7	R28	0402_RES	1
22R	R32, R33, R34, R35	0402_RES	4
Not Fitted (10K)	R36, R64, R65, R66	0402_RES	4
200K	R38	0402_RES	1
100R	R39, R45	0402_RES	2
36K	R46	0402_RES	1
1K5	R50	0402_RES	1
0R	R61	0603_RES	1
Close	SB1, SB2, SB3, SB4, SB5, SB6, SB7, SB8, SB10, SB13, SB14, SB15, SB17, SB18, SB21	SB	15
Open	SB9, SB11, SB12, SB16, SB19, SB20	SB	6
PT	TP1, TP2, TP3, TP4, TP5, TP6	PTB	6
Comment	TP9	LOGO CE	1
STM32L475VGTx	U1	LQFP100 14x14x1.6	1
MP34DT01-M	U2, U10	HCLGA-4LD 3x4x1	2
LSM6DSL	U3	LGA14L-2.5X3X0.86p0.5	1
VL53L0X	U4	LGA12-optical	1
LIS3MDL	U5	VFLGA12-2x2x1	1
HTS221	U6	HLGA6L-2x2x0.9	1
LPS22HB	U7	HLGA10L-2X2X0.76	1
M24SR64-Y	U8	SOP8	1
STSAFE-A100 (Not Fitted)	U9	SOP8	1
MX25R6435F	U11	SOP8L	1
LT1963EST-3.3	U12	SOT223_SC73	1
LD1117S50TR	U13	REG_SOT223-TAB	1
LD1117S33TR	U14	REG_SOT223-TAB	1
STM32F103CBT6	U15	ICC_LQFP48_7X7_P050	1
LD3985M33R	U16	REG_SOT23-5L	1
ST890CDR	U17	ICC_SO8_5X4_P127	1
EMIF02-USB03F2	U18, U20	ESD_FLIP-CHIP-BGA11_1P44X1P94_P050	2
STMPS2141STR	U19	MOS_SOT23-5L	1
TSV631AILT	U21	SOT23-5	1
Not Fitted (NX3225GD-8.00M)	X1	CRY_NX3225GD_2P	1
NX3215SA-32.768K	X2	CRY_NX3215SA_2P	1
NX3225GD-8.00M	X3	CRY_NX3225GD_2P	1

附件：

. ?1 @2 V6 g% K原理图和PCB源文件如下：

游客，如果您要查看本帖隐藏内容请回复

, E4 P$ b' {" R: c' v. d6 u* Q. t