[allegro16.6][4层] KW41 无线微控制器 (MCU)（MKW41Z512VHT4+74LVC125+MK22FN512V...

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[allegro16.6][4层] KW41 无线微控制器 (mcu)（MKW41Z512VHT4+74LVC125+MK22FN512VMP12）pcb文件

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1. 作品用途：KW41 无线微控制器 (MCU)
2. 软件版本：allegro16.6
3. 层数：4层
4. 用到的主要芯片：MKW41Z512VHT4+74LVC125+MK22FN512VMP12
: Y0 G+ M; K% Y( p4 q9 P5. pcb尺寸： 18.669* 61.468 MM
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作品截图如下：
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. [0 _% U  U& C% U4 U* P顶层截图：
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+ D5 ~3 y; T! R0 Z1 F& i( P底层截图：


6 R# C( T1 u7 {! f+ |全层截图：
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( [- i: V7 L8 r7 e5 W. b$ z叠层阻抗信息如下：

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Bill of Material Report (Condensed)
SYM_NAME	COMP_DEVICE_TYPE	COMP_VALUE	COMP_CLASS	QUANTITY	REFDES
名称	类型	属性	类别	数量	位号
0402_MLP	DIODE_TVS_BIDIR_0402_MLP_IC_0.4	0402ESDA-MLP	IC	3	U2; U3; U9
1812	FUSE_RESETTABLE_1812_IC_0.62MM_	MINISMDC050F-2	IC	1	RT1
ANTENNA_MEANDER	ANTENNA_MEANDER_ANTENNA_MEANDER	MEANDER_ANT_HORZ	IC	1	ANT1
CC0402_25	CAP_NP_CC0402_25_DISCRETE_0.55	0.7pF	DISCRETE	1	C4
CC0402_25	CAP_NP_CC0402_25_DISCRETE_0.5_2	12PF	DISCRETE	4	C6; C7; C23; C24
CC0402_25	CAP_NP_CC0402_25_DISCRETE_0.6MM	1000pF	DISCRETE	2	C8; C35
CC0402_25	CAP_NP_CC0402_25_DISCRETE_0.55M	2.2UF	DISCRETE	2	C16; C37
CC0402_25	CAP_NP_CC0402_25_DISCRETE_0.5_1	0.1uF	DISCRETE	9	C21; C27; C28; C29; C31; C32; C33; C36; C46
CC0402_25	CAP_NP_CC0402_25_DISCRETE_0.74	0.01UF	DISCRETE	1	C34
CC0402_25	CAP_NP_CC0402_25_DISCRETE_0.5_4	1.5pF	DISCRETE	1	C47
CC0402_25	CAP_NP_CC0402_25_DISCRETE_0.5_5	0.5PF	DISCRETE	1	C48
DQFN14_3X2P5MM	74LVC125_DHVQFN_14P_DQFN14_3X2P	74LVC125	IC	1	U8
HDR_2X5_6X3_1P27MM_TH	CONN_HDR_5X2_HDR_2X5_6X3_1P27MM	HDR 2X5	IO	2	J1; J6
IND_0402	INDUCTOR_IND_0402_DISCRETE_0.55	0.0051uH	DISCRETE	1	L3
IND_0805	BEAD_IND_0805_DISCRETE_1.05 MM_	330 OHM	DISCRETE	2	L4; L5
LED_2P_0805	LED_LED_2P_0805_IC_1.1MM_370-76	YEL-GRN	IC	1	D1
LED_2P_0805	LED_LED_2P_0805_IC_1.1MM_370-_1	RED	IC	2	D2; D3
MAPBGA64_0P5_5X5	MK22FN512_BGA_64P_MAPBGA64_0P5_	MK22FN512VMP12	IC	1	U5
MAPLGA48_7X7_0P5MM	KW41Z512_64P_MAPLGA48_7X7_0P5MM	MKW41Z512VHT4	IC	1	U1
MECH_HOLE_50MIL	MOUNTING_HOLE_1P_MECH_HOLE_50MI	MH_50mil	IC	4	MH1; MH2; MH3; MH4
RC0402_25	RES_RC0402_25_DISCRETE_0.4 MM_4	2.2K	DISCRETE	2	R4; R5
RC0402_25	RES_RC0402_25_DISCRETE_0.40 MM_	10K	DISCRETE	3	R6; R20; R21
RC0402_25	RES_RC0402_25_DISCRETE_0.4MM__3	33	DISCRETE	2	R7; R8
RC0402_25	RES_RC0402_25_DISCRETE_0.41MM_4	330	DISCRETE	3	R9; R10; R14
RC0402_25	RES_RC0402_25_DISCRETE_0.4MM__1	27K	DISCRETE	1	R22
RC0402_25	RES_RC0402_25_DISCRETE_0.4MM__2	1.0K	DISCRETE	2	R23; R25
RC0402_25	RES_RC0402_25_DISCRETE_0.45 MM_	0	DISCRETE	5	R26; R27; R28; R29; R30
SH0402	RES_SHORT-2_SH0402_DISCRETE_0.1	0	DISCRETE	15	SH1; SH2; SH3; SH4; SH5; SH6; SH7; SH8; SH9; SH10; SH11; SH12; SH13; SH14; SH15
SOT23-5	NC7SZU04M5X_SOT23-5_IC_1.45MM_3	NC7SZ14M5X	IC	1	U6
SW2_TACT_4X3_SM	SW2P_SW2_TACT_4X3_SM_IC_2 MM_51	KAN0444-0201E1	IC	3	SW1; SW2; SW3
TPAD_030	TESTLOOP_TPAD_030_IO_0.1MM_211-	TPAD_030	IO	2	TP4; TP14
TPAD_040	TESTLOOP_TPAD_040_0.1MM_211-766	TPAD_040	IC	14	TP1; TP2; TP3; TP6; TP7; TP8; TP9; TP10; TP15; TP17; TP18; TP19; TP20; TP21
USB_TYPE_A_12X18P8_SM	USB_A_USB_TYPE_A_12X18P8_SM_IO_	USB-106AM-LCP	IO	1	J5
XTAL2-3P2X1P5-SM	CRYSTAL_XTAL2-3P2X1P5-SM_IC_0.9	32.768KHZ	IC	1	Y2
XTAL3_3P35X1P45_SM	XTAL_CS_XTAL3_3P35X1P45_SM_IC_0	8.00MHZ	IC	1	X1
XTAL4_2P1X1P7MM_SM	XTAL_13Y_XTAL4_2P1X1P7MM_SM_IC_	32MHZ	IC	1	Y1

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. P; b  Z) B2 W6 dPCB文件如下：

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