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作品名:[AD 15][2层] 23DK-S3A7开发套件 原理图、PCB源文件
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文件描述! z4 ?4 u. {* q1 k) P
1. 作品用途:23DK-S3A7开发套件" y E. z" N8 B# @$ g
2. 软件版本:AD 15
, D' Z& Y+ k* }, {/ X3. 层数:2层板, ~6 {4 @+ S' O! C
4. 用到的主要芯片:
) V9 P3 x* C/ T/ B7 a% g- J, O5. PCB尺寸:190mm*130mm7 |+ ]" z/ P* L- F+ U; Q
6 W% }7 V9 v8 X* I/ }作品截图如下:. A0 S6 g1 u: q
顶层截图:
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底层截图:8 m; M \' d5 v! H
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全层截图:
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叠层信息截图如下:
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`4 {4 X: s6 L) j6 g- PBOM:
' X# @8 k: f& {/ W: bComment(属性) | Designator(位号) | Footprint(封装) | Quantity(数量) | CAP-000029-01 | C100, C102, C106, C117, C134, C137, C138, C142, C143, C144, C145, C146, C147 | CAPC0603-01 | 13 | CAP-000066-01 | C101, C110, C122 | CAPC0603-01 | 3 | CAP-000072-01 | C103 | CAPC0603-01 | 1 | CAP-000070-01 | C105 | CAPMP7343-31-01 | 1 | CAP-000074-01 | C107, C139 | CAPC0603-01 | 2 | CAP-000084-01 | C108, C109, C112, C113, C114, C115, C116, C126, C128, C129, C131, C132, C133 | CAPC0201-01 | 13 | CAP-000067-01 | C111 | CAPC0402-01 | 1 | CAP-000057-01 | C118, C124 | CAPC0201-01 | 2 | CAP-000081-01 | C119, C121, C123, C125, C127 | CAPC0201-01 | 5 | CAP-000063-01 | C120, C136, C148, C149 | CAPC0402-01 | 4 | CAP-000073-01 | C130 | CAPC0402-01 | 1 | CAP-000043-01 | C135, C141 | CAPC0603-01 | 2 | CAP-000090-01 | C140 | CAPC0603-01 | 1 | IND-000011-01 | FB100, FB102 | FB_0402 | 2 | IND-000012-01 | FB101 | FB_0603 | 1 | CON-000050-01 | J100, J111 | SAMTEC_SSW-106-02-F-D-RA-PMOD | 2 | CON-000036-01 | J101 | SAMTEC_USB-A-S-F | 1 | CON-000153-01 | J102, J109 | HARWIN_M20-9960345 | 2 | CON-013002-01 | J103, J104 | MOLEX_79107-7214 | 2 | CON-000076-01 | J105, J106, J108 | FCI_10106813-061112LF | 3 | CON-000163-01 | J107 | CUI_SJ-43516-SMT | 1 | CON-000124-01 | J110 | CUI_SJ-3524-GR | 1 | CON-000130-01 | J112 | CUI_SJ-3524-BE | 1 | CON-000174-01 | JMP100 | FCI_77313-801-04LF | 1 | CON-000184-01 | JMP101 | FCI_77313-801-06LF | 1 | IND-000007-01 | L100 | BOURNS_SRN3015 | 1 | RES-000144-01 | R100 | RESC0402-01 | 1 | RES-000137-01 | R101, R103, R104, R106, R108, R109, R110, R112, R113, R114, R115 | RESC0402-01 | 11 | RES-000139-01 | R102, R105, R116 | RESC0402-01 | 3 | RES-000155-01 | R107 | RESC0402-01 | 1 | RES-000116-01 | RA100, RA101 | RESCAF0804 | 2 | CON-000074-01 | SD100 | FCI_100067847-01 | 1 | FAS-000018-01 | SO100, SO101, SO102, SO103 | PEM_SMTSO-M3-4 | 4 | FAS-000043-01 | TOOL1, TOOL2 | Keystone-1377 | 2 | CON-000047-01 | TP100, TP101, TP102, TP103, TP104, TP105, TP106, TP107, TP108, TP109 | KEYSTONE_5015 | 10 | ICN-000072-01 | U100 | TI_PVSON-N10 | 1 | ICN-000165-01 | U101 | TI PDSO-N5 | 1 | ICN-000182-01 | U102 | MICRON_V-PDFN-8-6 | 1 | ICN-000131-01 | U103 | TI_DSE-PWSON-N6 | 1 | ICN-000129-01 | U104 | MAXIM_TQFN56 | 1 | ICN-000181-01 | U105 | OSRAM_SFH7776 | 1 | ICN-000184-01 | U106 | KIONIX_KX022-LGA12 | 1 | ICN-000179-01 | U107 | HONEYWELL_LCC-16 | 1 | ICN-000180-01 | U108 | ONSEMI_UDFN8 | 1 | ICN-000010-01 | U109 | MSOP8_N | 1 | 附件:" ?" K( f& Z: Z+ b- Q# p
原理图和PCB源文件如下:; m) k, p/ z) e+ B3 d h
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