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Standard PCB Layer Stack Up – 4 to 12 Layer
$ U& o% t- e" hPre‐Preg Thickness ‐ 1080 = 3.04 mil ‐ 2116 = 4.67 mil ‐ 7628 = 7.68 mil
2 H+ q; L& Z* [: B0 a9 t4 LAYER' D/ `1 c) m3 f% l
Top Layer ‐ 18um Copper Foil (plated to 35um+)
% K3 b) |) W5 M5 G3 WPre‐Preg ‐ 1 x 1080 + 1 x 7628
, ~$ l7 J+ W o9 rLayer 2 & 3 ‐ 1.0mm Fr‐4 Core with 35um/35um Copper. U" ]5 q, Y5 Z$ ^8 Z6 n
Pre‐Preg ‐ 1 x 1080 + 1 x 7628
4 a+ Y4 \ c- S' VBottom Layer ‐ 18um Copper Foil (plated to 35um+)- w1 B, G# W6 F6 d9 }( p8 c) [1 t
1.6mm +/‐ 10%
8 q' X) ?& s# }4 |8 }" e) |6 LAYER. h& c0 |* O, } _. _5 u7 J4 |5 }
Top Layer ‐ 18um Copper Foil (plated to 35um+)
; R, n4 g( |# [$ e zPre‐Preg ‐ 1 x 1080 + 1 x 76280 c' x1 _4 n8 s- |$ ], _$ m9 x+ o
Layer 2 & 3 ‐ 0.36mm Fr‐4 Core with 35um/35um Copper2 z% y8 p. \# s
Pre‐Preg ‐ 1 x 7628! S2 K' J& e4 r2 ?8 ~$ s9 _- d8 m
Layer 4 & 5 ‐ 0.36mm Fr‐4 Core with 35um/35um Copper
" ?& i; F6 h7 [Pre‐Preg ‐ 1 x 1080 + 1 x 7628
* \7 S, x3 o; E* y8 o# \Bottom Layer ‐ 18um Copper Foil (plated to 35um+)
7 }- T4 u3 G$ {7 S+ ]& y1.6mm +/‐ 10%( R6 {0 I- n/ |5 @: h
8 LAYER5 D" @, U8 x+ h
Top Layer ‐ 18um Copper Foil (plated to 35um+)
3 r$ o' R! |( r7 @0 h/ _Pre‐Preg ‐ 2 x 21162 Y/ J6 a1 l3 b1 ]! I" E
Layer 2 & 3 ‐ 0.15mm Fr‐4 Core with 35um/35um Copper: ^/ t, x6 @- z/ l2 M/ Z1 p6 q
Pre‐Preg ‐ 2 x 2116( U7 j7 k" R4 ~
Layer 4 & 5 ‐ 0.15mm Fr‐4 Core with 35um/35um Copper8 n# h" Q$ Y2 F" S+ x# i# E) O' J' L
Pre‐Preg ‐ 2 x 2116
! k, T5 B% z5 ?- l# ELayer 6 & 7 ‐ 0.15mm Fr‐4 Core with 35um/35um Copper. k$ D, ?' S% y6 G+ ?8 _+ G6 `! p: U
Pre‐Preg ‐ 2 x 2116
$ W$ p% B6 ]& ?# a3 B9 IBottom Layer ‐ 18um Copper Foil (plated to 35um+) g! @* S, T8 y, Y. R
1.6mm +/‐ 10%8 ~" b! D3 @( E, H7 v/ E0 c2 u
10 LAYER2 a! j \7 Y5 \; y: J( N+ b! m* _
Top Layer ‐ 18um Copper Foil (plated to 35um+)5 @. a! u' i* f: `. D
Pre‐Preg ‐ 1 x 2116
: }' ^( C U6 ~; {, d) o% pLayer 2 & 3 ‐ 0.18mm Fr‐4 Core with 35um/35um Copper% _4 H- w% H' ~
Pre‐Preg ‐ 1 x 2116
7 h; x' L" d( `" v7 N8 b+ bLayer 4 & 5 ‐ 0.21mm Fr‐4 Core with 35um/35um Copper* p' V4 g- Y) Z& ^4 k
Pre‐Preg ‐ 1 x 2116
1 u: h/ y" E/ l$ s& g& \6 aLayer 6 & 7 ‐ 0.21mm Fr‐4 Core with 35um/35um Copper
/ L, Y0 d N' b3 r: ^6 f0 B, v& jPre‐Preg ‐ 1 x 2116
: A' _: Z) O% v A1 r1 _Layer 8 & 9 ‐ 0.18mm Fr‐4 Core with 35um/35um Copper
" N8 I; j4 m9 GPre‐Preg ‐ 1 x 2116
# @9 t4 E- I H$ E0 \Bottom Layer ‐ 18um Copper Foil (plated to 35um+)
4 @ R9 \0 e+ t1.6mm +/‐ 10%
9 o8 c: ^0 I" x; ^ S% Q& m% X12 LAYER
+ l. p {' d! C- P% x4 x$ mTop Layer ‐ 18um Copper Foil (plated to 35um+)8 x+ b; [7 ^; H! `# ~+ H
Pre‐Preg ‐ 1 x 2116- g' f! x+ d- D1 e0 ?) w" E
Layer 2 & 3 ‐ 0.13mm Fr‐4 Core with 35um/35um Copper
Z0 r! D+ c% KPre‐Preg ‐ 1 x 21162 e! O1 j. y' y. d: A. x; W
Layer 4 & 5 ‐ 0.13mm Fr‐4 Core with 35um/35um Copper
+ `8 z2 p% M' iPre‐Preg ‐ 1 x 2116
$ T( Q& a D1 ~" oLayer 6 & 7 ‐ 0.13mm Fr‐4 Core with 35um/35um Copper* h& x# K* @3 e
Pre‐Preg ‐ 1 x 2116# I3 w) G4 h1 B! f( A& s! _
Layer 8 & 9 ‐ 0.13mm Fr‐4 Core with 35um/35um Copper
6 G' i( j8 ^" w# ?5 B2 I" UPre‐Preg ‐ 1 x 2116
# P$ K* I% H9 ~; W3 ^Layer 10 & 11 ‐ 0.13mm Fr‐4 Core with 35um/35um Copper2 J/ y* ]5 j2 W1 u. U, X
Pre‐Preg ‐ 1 x 2116
" j5 O' M* ]5 G) i, jBottom Layer ‐ 18um Copper Foil (plated to 35um+)
) u5 x+ m& u- \3 A4 o# @: o1.6mm +/‐ 10% |
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发表于 2010-4-12 15:12