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本帖最后由 stupid 于 2010-6-30 14:56 编辑 - ]2 V% m. C+ V+ H C( d4 R# q
( N' h1 y8 N" eChip-Level Design
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) ~! S {, c, Z, ?& t# |Creating C++ IP for High Performance Hardware Implementations of FFTs- ]9 Y( V' H; `1 i& R# ^7 ~% H
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Strong Encryption and Correct Design Are Not Enough: Protecting Your Secure System from Side Channel Attacks
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Board and System Design
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! T: ^7 z4 W9 s& |% u; B w3 wEffect of Conductor Profile on the Insertion Loss, Phase Constant, and Dispersion in Thin High Frequency Transmission Lines- g; L8 y7 Q# V) J& f! Q- N# j
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Introduction and Comparison of an Alternate Methodology for Measuring Loss Tangent of PCB Laminates
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# a0 Z- k# |, Y, ], H9 G9 W; S/ ~Interconnect Design
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0 U2 {" U; j* ?4 U1 _Frequency Dependent Material Properties: So What?. q9 R q! F" _- \" A, S
/ s9 u) ?( n5 cAdditional Trace Losses due to Glass-Weave Periodic Loading. m4 |% ?7 S2 d: i! K" z3 `
9 G3 V! x2 w5 k# ^' v* jHigh-Speed Design and Test Category
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8 V* q9 D+ p) |, [2 t4 M8 oA New Method for Receiver Tolerance Testing Using Crest Factor Emulation
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Accuracy Improvements of PDN Impedance Measurements in the Low to Middle Frequency Range# B0 A9 ], j% e8 m! [" |9 t
6 h& m: m8 d: w" ^% ~& Z( R5 MPower and RF Design Category
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8 k9 D8 Q% ~* N& T$ p. k9 A6 _# SOn-Chip PDN Noise Characterization and Modeling
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Fast Physics-Based Via and Trace Models for Signal and Power Integrity Co-Analysis |
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发表于 2010-6-30 14:55
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反对！
发表于 2010-10-3 01:55