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1) BEGIN LAYER-----Thermal Relief Pad和Anti Pad比实际焊盘做大0.5mm/20mil
& V: P% X0 K$ n; @/ l' h2)END LAYER与BEGIN LAYER一样设置
) o9 w' }- z; x& n" X) \2)DEFAULT INTERNAL尺寸如下
, q; m4 I5 O( j% F$ _其中尺寸如下:1 `, U6 ? j4 s( A8 O
DRILL_SIZE >= PHYSICAL_PIN_SIZE + 0.25mm/10MIL $ |8 }) l0 d: Z. Q
Regular Pad >= DRILL_SIZE + 0.4mm/16MIL (DRILL_SIZE<1.27mm/50mil) Regular Pad >= DRILL_SIZE +0.76mm/ 30MIL (DRILL_SIZE>=1.27mm/50mil) - x9 a) P8 o/ H; k, t* `) \0 F+ a% @
Regular Pad >= DRILL_SIZE + 1mm/40MIL (钻孔为矩形或椭圆形时)(1mm)1 C! ^- `0 h) s6 P) | Y6 B
Thermal Pad = TRaXbXc-d其中TRaXbXc-d为Flash的名称(后面有介绍). r' K4 R: T$ _0 z. a/ e3 o
Anti Pad = DRILL_SIZE + 0.76mm /30MIL
# V& m* H/ \9 O' T( Q" n1 iSOLDERMASK = Regular_Pad + 0.15mm /6MIL
! h/ o0 I5 t# S8 M3 aPASTEMASK = Regular Pad (可以不要)
% P! L9 U9 ?' K- N, p/ i' [8 u•Flash Name: TRaXbXc-d 4 |. w# c/ @3 x) N
其中:
! n) F3 J$ Y! d/ Ha. Inner Diameter: Drill Size + 0.5mm/16MIL
6 D+ t8 x% P6 W" @& i( n9 Fb. Outer Diameter: Drill Size + 0.76mm/30MIL
2 f4 [( g' y2 s* D- {- `' jc. spokes:
+ K" `. L: F6 N) I- e4 h: Z) D( O; |6 i0.3mm/12mil (当DRILL_SIZE = 10MIL/0.25mm以下)
- e# u, A+ r, s, L" f* s& \0.4mm/15mil (当DRILL_SIZE = 11~40MIL/0.28mm~1mm)
; r( W3 {5 L) d3 Z+ n+ E b0.5mm/20mil (当DRILL_SIZE = 41~70MIL/1mm~1.8mm)
4 M! Z# T& o- h0.76mm/30mil (当DRILL_SIZE = 71~170 MIL/1.8mm~4.3mm). j0 H9 ~" {1 [, p4 M
1.0mm/ 40mil (当DRILL_SIZE = 171 MIL/4.3mm以上)
2 \. e6 S6 c. w' Z, |7 ^& ]/ M也有这种说法:至于flash的开口宽度,则要根据圆周率计算一下,保证连接处的宽度不小于0.25mm/10mil。8 k2 B: y g: v/ G& `* R2 @
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