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PCB设计中专业英译术语之基材：9 e* P' m n4 B1 X* V7 g
1. 基材：base material
; u: P3 E' q0 g. l( \& u 2. 层压板：laminate E9 W% b3 p" S) S p8 i
3. 覆金属箔基材：metal-clad bade material
8 s% A' Z7 b( `8 e# F 4. 覆铜箔层压板：copper-clad laminate (CCL)
0 V4 V* X, K/ J2 q7 I& c 5. 单面覆铜箔层压板：single-sided copper-clad laminate" q% H) Q& d# f& ?
6. 双面覆铜箔层压板：double-sided copper-clad laminate
6 o. J) r. N3 p' ^' Z 7. 复合层压板：composite laminate# t( B! I+ v4 O4 b/ B
8. 薄层压板：thin laminate
8 U# o2 q8 e* W5 d1 ^$ u$ R" K 9. 金属芯覆铜箔层压板：metal core copper-clad laminate0 a% v: H: J: b! G
10. 金属基覆铜层压板：metal base copper-clad laminate
( R, }1 v) P8 a9 s9 ]6 b 11. 挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film
+ R |5 T5 M/ t7 K/ Z& \0 Z 12. 基体材料：basis material
! E, V2 W8 R: c: G: H7 ^ 13. 预浸材料：prepreg, G! m2 o- z- a) e7 l! _
14. 粘结片：bonding sheet: ], H# y: a+ Y3 |- X' R
15. 预浸粘结片：preimpregnated bonding sheer) n6 O5 y/ L: ?1 f3 i
16. 环氧玻璃基板：epoxy glass substrate2 J4 p! I# C' K/ f; ]
17. 加成法用层压板：laminate for additive process
/ v( m7 ~0 N! N0 ]/ u 18. 预制内层覆箔板：mass lamination panel
4 P6 p- W! M* w4 z 19. 内层芯板：core material2 n& l% i- s' a: k7 B' h7 P" \
20. 催化板材：catalyzed board ,coated catalyzed laminate
# v- N5 {% y) w& T! r- T 21. 涂胶催化层压板：adhesive-coated catalyzed laminate5 I. N( y) h4 l2 n% r" G
22. 涂胶无催层压板：adhesive-coated uncatalyzed laminate
( C! J: n+ j* A7 E) L 23. 粘结层：bonding layer$ b2 {* ]. `- s, \
24. 粘结膜：film adhesive
2 o. f% Z" z t% C) U2 r 25. 涂胶粘剂绝缘薄膜：adhesive coated dielectric film
/ D, v- H9 S5 W2 v3 M0 }- P5 r 26. 无支撑胶粘剂膜：unsupported adhesive film1 O5 f" I, U9 |( z4 y$ |1 \! _
27. 覆盖层：cover layer (cover lay)
- ^. Y! X/ V2 Y( o( d6 M 28. 增强板材：stiffener material' `' L( i4 ~% l8 G
29. 铜箔面：copper-clad suRFace
' q- ]3 Y: Q0 m* U4 f 30. 去铜箔面：foil removal surface/ M' @" ?! L! ^8 c& k: p) ]- B. f% E
31. 层压板面：unclad laminate surface
4 W! z' q( S, W( t7 P0 ^5 A7 v 32. 基膜面：base film surface) v. R& G% t% i$ Z( {, e4 Y3 A
33. 胶粘剂面：adhesive faec
2 b5 U# O S( W# K" R 34. 原始光洁面：plate finish
; _; Z$ k0 h7 F/ X( z: ? 35. 粗面：matt finish. S( Z5 w9 t+ K; W: d7 t
36. 纵向：length wise direction
) y# b4 J( o+ K( Q3 J( @1 ^ 37. 模向：cross wise direction
& l/ v, x4 k U j8 v6 F 38. 剪切板：cut to size panel6 q1 H' m. c( K1 @4 p- W6 H. d
39. 酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)7 q8 T) k/ G" n8 j: R! u
40. 环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)9 z6 u) j: h+ M0 O
41. 环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates
) s7 ? B2 s2 I$ j& Y5 p 42. 环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates u7 e3 Y8 T, } n+ Q8 X
43. 环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates5 X" d2 t9 l. ~3 G$ P' z- s. O
44. 聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates% W; n+ L: H4 t; m! j- ^
45. 聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates
0 `- T/ E" T J 46. 双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates7 p+ E# {& ?# K4 J6 `2 d
47. 环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates/ G/ a7 u; [0 b' w0 N8 [- J& J
48. 聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates
6 |; \$ g* q4 J* O+ y 49. 超薄型层压板：ultra thin laminate
# k# p! g. M5 X. X& f 50. 陶瓷基覆铜箔板：ceramics base copper-clad laminates6 a0 g+ z7 j7 R: F! b
51. 紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates |
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发表于 2021-7-5 10:50
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