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) A: R! S5 T, i2 Z8 u- g 1. 板：board
9 L: J2 R" z" u, u1 s 2. 印制板：printed board
; [6 F5 j" L2 c- U- {8 [. L6 v7 N/ _ 3. 印制电路：printed circuit
% J8 z; u, o% Y: a6 i. n# `- a0 T6 ? 4. 印制线路：printed wiring
7 b5 C# u" ^5 m6 i. q 5. 印制线路板：printed wiring board(PWB)
# }/ a4 I" X6 b" s7 S' x 6. 印制板电路：printed circuit board (PCB)/ r6 J: v N" @9 k$ w
7. 印制接点：printed contact" ~8 {- S% Y6 c d- L! @- q
8. 印制组件：printed component
3 i& Z: z! K8 B a 9. 印制板装配：printed board assembly
8 I a) M! i) }; }8 w0 w* q 10. 单面印制板：single-sided printed board(SSB)/ z4 k! M6 I e$ x: G
11. 双面印制板：double-sided printed board(DSB)
+ L1 \4 }/ N( [6 m6 u2 f 12. 多层印制板：mulitlayer printed board(MLB)
- r" d# R5 E; y% \+ S) r; ]5 Q0 M+ x 13. 多层印制电路板：mulitlayer printed circuit board. d0 w/ }$ K4 z2 Y
14. 多层印制线路板：mulitlayer prited wiring board; W1 s1 F a$ n5 w& T2 d3 E
15. 刚性印制板：rigid printed board! P8 D+ C" i+ A; ^2 t) L
16. 刚性单面印制板：rigid single-sided printed borad
# J+ h g8 k) n 17. 刚性双面印制印制板装配：printed board assembly6 q- D2 s4 n. b" o8 B
18. 刚性多层印制板：rigid multilayer printed board+ \& E6 R/ A. H) e
19. 挠性多层印制板：flexible multilayer printed board- H; Z: @5 Z: u/ A. D5 @
20. 挠性印制板：flexible printed board
; }, @1 i0 j" I! H6 I 21. 挠性单面印制板：flexible single-sided printed board
) o4 K- T4 ?4 Y 22. 挠性双面印制板：flexible double-sided printed board
9 w8 Q9 M9 O' O. o7 V. i: H9 w4 F 23. 挠性印制电路：flexible printed circuit (FPC)
9 g! V: ?7 H& Y% P: c 24. 挠性印制线路：flexible printed wiring
) K* _) ~+ p p5 A. B# O5 ~ 25. 刚性印制板：flex-rigid printed board, rigid-flex printed board5 i+ R" x) h, D% f
26. 刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
' G# X% |0 N) ?; z- M. N 27. 刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board
+ O! A2 a. i% h0 _2 Z# E0 i, W 28. 齐平印制板：flush printed board
- ^1 ~ Y8 P% |4 V6 L1 P$ z! ]+ R 29. 金属芯印制板：metal core printed board: l) M% L2 ~$ m- \
30. 金属基印制板：metal base printed board
: B t0 i* M/ X! P1 d 31. 多重布线印制板：mulit-wiring printed board1 Z9 C. _" j3 T- ]) ?- H1 @1 c
32. 陶瓷印制板：ceramic substrate printed board
- [( Q: D: T' L 33. 导电胶印制板：electroconductive paste printed board2 P! Z# ~" y7 M( D+ V. Y9 G+ U
34. 模塑电路板：molded circuit board
# H6 X7 ~9 H2 V# S3 { 35. 模压印制板：stamped printed wiring board+ N9 f1 K' S9 c/ ^
36. 顺序层压多层印制板：sequentially-laminated mulitlayer9 o: v( N3 n3 @3 Z6 V8 h# L
37. 散线印制板：discrete wiring board
+ E5 R% R+ O+ d4 s4 l& w 38. 微线印制板：micro wire board
?* i5 n3 y, B 39. 积层印制板：buile-up printed board
; Q1 U' }5 r. G2 ]9 ^. K 40. 积层多层印制板：build-up mulitlayer printed board (BUM)! x+ m1 S1 u' |: v& p
41. 积层挠印制板：build-up flexible printed board i( ~, T, Y0 H/ @" V# h+ a" Q
42. 表面层合电路板：suRFace laminar circuit (SLC)" D. w, K6 V/ Q4 @8 X! g
43. 埋入凸块连印制板：B2it printed board
: N+ v# K' n$ O; s/ d/ E& S# J- I2 _. M 44. 多层膜基板：multi-layered film substrate(MFS)- V* b# G( B6 [. `- J3 k; K
45. 层间全内导通多层印制板：ALIVH multilayer printed board
; S) U# J- D- X) l$ J- M. ] 46. 载芯片板：chip on board (COB)
6 O. w0 c y/ m* c9 K 47. 埋电阻板：buried resistance board
6 h! |# F/ q) x# y8 G9 I# t 48. 母板：mother board5 m+ h" A& T7 l( ?( l
49. 子板：daughter board; y' I. l8 d3 Q) g" V. A$ _8 b
50. 背板：backplane3 Q: ]5 v! C, U! z3 T$ Q. X
51. 裸板：bare board m1 c" g p- s$ Y* \
52. 键盘板夹心板：copper-invar-copper board
+ g: n# x( P1 K' e 53. 动态挠性板：dynamic flex board. H/ v$ l* |, p, W
54. 静态挠性板：static flex board
: k5 A7 n; s, \- R" Q" V3 ^ 55. 可断拼板：break-away planel( ~% B( P& C5 g: t7 \9 v
56. 电缆：cable7 n, J( T# Y3 u$ P& [7 t4 _
57. 挠性扁平电缆：flexible flat cable (FFC)& [7 w- E8 _& |7 W
58. 薄膜开关：membrane switch
; j# y, o# q# I5 l/ V, n' i: R 59. 混合电路：hybrid circuit
& \: E% l6 H. h9 \7 Q L& E2 Z 60. 厚膜：thick film* M3 E N$ Z% f: t7 D6 P; R
61. 厚膜电路：thick film circuit
! S9 V$ f2 ~: J& Z$ ^ 62. 薄膜：thin film
1 V9 ?8 E8 i! l! A3 l, y* V* v 63. 薄膜混合电路：thin film hybrid circuit
$ E& Q3 o0 h1 H3 u+ ~# K& K8 B 64. 互连：interconnection5 H9 a1 q4 [( |
65. 导线：conductor trace line" _& N0 P% W# }: [; i
66. 齐平导线：flush conductor
* U# j0 [, E" A- ?1 Q2 e' D1 T 67. 传输线：transmission line' W5 E* j8 [$ t. E4 f' }) ]
68. 跨交：crossover
2 w' g/ @& P( K 69. 板边插头：edge-board contact, U9 q: a R E% n
70. 增强板：stiffener- H# y. Q( L5 l, d, H. {- m) X
71. 基底：substrate8 |9 a& V' H0 l. j7 g5 \
72. 基板面：real estate
0 _2 r, l4 C t( A- R 73. 导线面：conductor side: P. P R2 t; J& b- A
74. 组件面：component side6 ~5 ?: P/ A+ Y! P5 b H
75. 焊接面：solder side
7 t- r$ P2 t" b 76. 印制：printing, G7 U$ {; z$ v' N8 s: o
77. 网格：grid
8 [& p) O8 C9 s, t3 ]; a/ X 78. 图形：pattern
% [8 q4 i9 _4 N/ B4 u5 V. b 79. 导电图形：conductive pattern( @, l$ t+ Y1 o$ i0 I) f
80. 非导电图形：non-conductive pattern
3 k" o* q+ f6 G6 t4 R! D4 A 81. 字符：legend
% ?. g, `) J! w* [- N 82. 标志：mark |
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发表于 2021-7-7 10:12
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