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1、 基材:base material
/ i9 N4 _: [0 o) U9 c2、 层压板:laminate5 i/ N" q& k6 i: P& {1 l
3、 覆金属箔基材:metal-clad bade material- z0 t3 V' m; [8 U9 G' r! M5 ^+ d
4、 覆铜箔层压板:copper-clad laminate (ccl)
5 Y9 F2 M3 N3 v5 Y1 `. Q, g* [5、 单面覆铜箔层压板:single-sided copper-clad laminate
+ Y3 [3 Z6 Q! T- G( @$ U& \( e6、 双面覆铜箔层压板:double-sided copper-clad laminate6 w& a% q" f! o1 N$ l# R
7、 复合层压板:composite laminate! {) @0 r( p X1 G- L2 m1 _
8、 薄层压板:thin laminate
1 v, W; M8 B$ [9、 金属芯覆铜箔层压板:metal core copper-clad laminate
! N- O) T/ U3 m4 u- w, @10、 金属基覆铜层压板:metal base copper-clad laminate
) v( k6 B/ Q- J" R+ U3 A+ h11、 挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film2 u* v- N3 ^& G# @' ~% c
12、 基体材料:basis material: _% P, ~. d* v- a. ^+ F- i
13、 预浸材料:prepreg
; l% d* O9 _( S8 U7 t$ E4 g14、 粘结片:bonding sheet
& G; v, c) i3 U5 K9 T+ Y& {15、 预浸粘结片:preimpregnated bonding sheer* G3 D% o5 b7 N9 @/ m @
16、 环氧玻璃基板:epoxy glass substrate
' d% u3 J, E+ h+ E17、 加成法用层压板:laminate for additive process1 L6 ~" G% Z" ~- q/ Q5 u- V9 O
18、 预制内层覆箔板:mass lamination panel
1 F. g0 H0 ?9 t: }- g' B19、 内层芯板:core material8 X8 P) O) a; a4 E3 O. V) e
20、 催化板材:catalyzed board ,coated catalyzed laminate
* B d% ?- ~- p. a; a21、 涂胶催化层压板:adhesive-coated catalyzed laminate
0 D' T a8 q5 I% {0 i' Z22、 涂胶无催层压板:adhesive-coated uncatalyzed laminate. K/ O; c6 W5 S/ m% c% O6 T
23、 粘结层:bonding layer
/ d7 Q* Z6 N6 \" q4 W' f24、 粘结膜:film adhesive7 D; K2 `! y% A0 A
25、 涂胶粘剂绝缘薄膜:adhesive coated dielectric film0 W; r) ~! d# q# [
26、 无支撑胶粘剂膜:unsupported adhesive film! l% v1 D2 ?% ~# B
27、 覆盖层:cover layer (cover lay)/ N; K9 R6 V7 K$ [3 p6 Y- N
28、 增强板材:stiffener material
0 D1 f `* a* `- y2 I; y29、 铜箔面:copper-clad suRFace
; S' K4 O! ?) U9 M30、 去铜箔面:foil removal surface
0 B8 C5 Y' q0 q* L7 |# }0 L31、 层压板面:unclad laminate surface
9 u$ }5 b9 M* ^+ \+ M3 K5 w8 @32、 基膜面:base film surface# \$ {4 [7 a/ R9 j0 Q% r
33、 胶粘剂面:adhesive faec
3 }4 k! A+ ~# Q: C% m1 |; X ^34、 原始光洁面:plate finish
! {4 L4 ]5 b* [3 n5 ]35、 粗面:matt finish! B {, W; b- n
36、 纵向:length wise direction
1 b) ?# ?+ B4 `* U& w37、 模向:cross wise direction, I: H. X1 e G
38、 剪切板:cut to size panel( `5 U9 b9 i3 i, s+ A
39、 酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)
3 L5 w' w2 \8 A; N g) L40、 环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)
, W1 b2 b9 b4 I! _/ @% [5 b41、 环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates& l. N6 e6 f8 C p" `3 c
42、 环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates) N( b" k0 O8 n: x. ~
43、 环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates- y) k$ A# X6 K/ }7 Z& l
44、 聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates5 E5 T: p. B( I% E: {2 U
45、 聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates
- X# F4 i+ ^$ | @" h2 q) K46、 双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates
5 L5 O# \: Y! `0 F/ z47、 环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates
: C$ C2 r7 e$ z$ \6 t48、 聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates, U9 G1 T( ^' ? m8 q, }: ]5 ~
49、 超薄型层压板:ultra thin laminate
# [6 Q2 a* G; G8 q# k$ E1 v50、 陶瓷基覆铜箔板:ceramics base copper-clad laminates
/ a' V+ a( E) _51、 紫外线阻挡型覆铜箔板:uv blocking copper-clad laminates' e! |5 q) g$ E+ b
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