Cadence SPB OrCAD 16.60.018 Hotfix| 853 mb

suiwinder · 发表于 2013-10-27 19:15

EDA365欢迎您登录！

您需要登录才可以下载或查看，没有帐号？注册

x

cadence SPB orcad 16.60.018 Hotfix| 853 mb

Cadence Design Systems, Inc. announce hotfix version 013 for 16.60 release. This update includes some critical bug fixes. Cadence Design Systems, Inc., a leader in global electronic design innovation, launched the Cadence OrCAD 16.6 design solution with new features, enhanced customization capabilities, and 20 percent simulation peRFormance improvements that provide customers a shorter, more predictable path to product creation.

This latest release offers numerous improvements to tool usability and performance, but at the heart of 16.6 are three key benefits: enhanced miniaturization capabilities, timing-aware physical implementation and verification for faster timing closure, and the industry’s first electrical CAD team collaboration environment for PCB design using Microsoft SharePoint technology.

A hot fix is a software maintenance package containing a small number of code fixes, designed to fix a sall number of critical problems. A hot fix enables a customer to receive fixes for urgent problems, without having to wait for the next service pack.

Each successive Fix Pack is comprehensive and contains the material from the earlier Fix Packs for that Release, as well as all Interim Fixes made available since the previous Fix Pack or full Release. In other words, when multiple Fix Packs are available, you would not need to apply Fix Pack 1 before applying Fix Pack 2.

About Cadence Design Systems, Inc.

Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry.

Download uploaded
http://uploaded.net/file/x6d2k0l3/enSrD166018t.rar

Download filefactory
http://www.filefactory.com/file/1plfcyvi13jl/n/enSrD166018t.rar

Download 城通网盘
http://www.400gb.com/file/33108970

rongzhai · 发表于 2013-10-27 20:29

顶楼主，楼主V5

mengshang · 发表于 2013-10-28 06:10

上面几个链接，怎么下载不了呢

minidust · 发表于 2013-10-28 09:22

官方都没出，你们出了？

cxyjoe · 发表于 2013-10-29 11:32

minidust 发表于 2013-10-28 09:22% ~+ A9 k' u$ [6 L3 [! Y; p
官方都没出，你们出了？

你这样很打击别人上传的积极性，别人骗你有啥好处，我下载了，安装了，你可以不下载

pzt648485640 · 发表于 2013-10-29 12:00

官方确实更新了，要相信楼主的无私的奉献
DATE: 10-25-2013 HOTFIX VERSION: 018

===================================================================================================================================

CCRID PRODUCT       PRODUCTLEVEL2 TITLE

===================================================================================================================================

1118303 CONCEPT_HDL CONSTRAINT_MGR can not prdefine default units in HDL

1174901 ALLEGRO_EDITOR GRAPHICS       Spurious odd lines are shown in shapes and text that are not part of the design with opengl

1176990 CONCEPT_HDL OTHER          DEHDL BOM tool doesn縯 see similar names.

1179665 GRE          CORE          Plan Topological Crashes after around 8 hours of routing.

1188193 CONCEPT_HDL CHECKPLUS       CheckPlus not recognizing PIN as a base object.

1189100 SCM          OTHER          Replace part in SCM using ADW as library fails

1189507 SCM          SCHGEN          ERROR(SPCOCN-2009): Package error after second schgen run with Preserve mode.

1192391 CONSTRAINT_MGR CONCEPT_HDL    Restore from definition deletes local objects in other blocks

1194597 FSP          OTHER          Pin definition problem

1195202 SIP_LAYOUT    LEFDEF_IF       Cannot add .lef files in IC Library Manager. Getting warning message WARNING(SPMHLD-52)

1195309 GRE          CORE          GRE crashing during Plan Spatial.

1197262 ALLEGRO_EDITOR MANUFACT       Angular Dimension created in symbol is placed w.r.t. board origin and angle is blank

1198521 CONCEPT_HDL OTHER          Cadence DEHDL issue - Note for Hotfix_SPB16.60.016_wint_1of1

1199219 ALLEGRO_EDITOR INTERFACES    Question on STEP Model export which uses PLACE_BOUND layer for any symbols that do not have STEP model mapped

1199235 ALLEGRO_EDITOR SCHEM_FTB       capture's behavior is redundant while creating pcb editor netlist

1199323 GRE          IFP_INTERACTIVE  Crash when importing logic

1199368 SIP_LAYOUT    DIE_EDITOR    Refresh of die abstract in die editor with this design takes over two hours

1199760 ALLEGRO_EDITOR DATABASE       Allegr won't display Soldermask Top layer