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THERMO-MECHANICAL TEST! d# D8 ^7 S# E' e x
PURPOSE:$ o6 E0 ^& ?* T$ E# [
The thermo-mechanical tests evaluate possible failure mechanisms caused by differences in ! }. F1 O$ {9 N3 m! \! M& Y) E
the thermal expansion coefficient of the different materials used in the board assembly9 [$ s, n* @3 C, J
REFERENCE STANDARD:+ b2 r; r$ g( u& R
The test was run according to JEDEC standard JESD-A104 condition G (Temperature $ `1 L+ {3 K! y7 t
Cycling). Temperature ramp rate is 11oC/minute.
3 R7 Q9 n% p* L$ E% d& |/ Q6 uRESULT:
- Q3 {) k: Q2 k" y, S7 y After 500 cycles:
. m; [' l! F3 D: _7 Ao SnBiAg1 solder alloy
6 b3 u- d! k9 N* V$ I ^# t 64 units in temperature cycling8 O, L+ n% N M# S2 h; {
One early failure seen after 10 cycles. Expect this is an early failure. No
; M8 L0 W3 r2 a7 F! Wadditional failures noticed till 500 cycles.2 V- Y" O/ Y, A4 t' p
o LMPA-Q solder alloy
2 \ q. l! L) @; w. e" d 64 units in temperature cycling
6 V7 P8 R, Y5 B# l \! K, x No failures noticed till 500 cycles.! ` N) ]1 u7 m$ a( T- C4 R+ P$ X
o LMPA-Z solder alloy7 s$ U& A9 p0 [- d2 D9 x3 p% x1 W
64 units in temperature cycling
6 d. a0 j8 r+ X$ ?- f2 ]3 l No failures noticed till 500 cycles
8 T9 T! [5 F! ?9 p
, a3 @2 x8 O3 V u2 b2 P( O H
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发表于 2019-11-26 13:43
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