LMPA thermal cycling

Taio

THERMO-MECHANICAL TEST
PURPOSE:
The thermo-mechanical tests evaluate possible failure mechanisms caused by differences in
7 h5 Q  @% a% _0 E( U" q* w- hthe thermal expansion coefficient of the different materials used in the board assembly
0 T2 D: a, T8 M4 nREFERENCE STANDARD:
The test was run according to JEDEC standard JESD-A104 condition G (Temperature
0 ?- T- C6 V; ?( u! D) PCycling). Temperature ramp rate is 11oC/minute.
RESULT:
 After 500 cycles:
/ d6 D" h# d/ J; o3 c3 Q% x* Po SnBiAg1 solder alloy
# D! V" C4 I. R+ E% k 64 units in temperature cycling
 One early failure seen after 10 cycles. Expect this is an early failure. No
additional failures noticed till 500 cycles.
. L% y% s9 c# T. j: {& C  yo LMPA-Q solder alloy
. j! L% ~% {6 I! B3 K 64 units in temperature cycling
 No failures noticed till 500 cycles.
o LMPA-Z solder alloy
- k! B5 U& Y- o3 b/ }: V 64 units in temperature cycling
 No failures noticed till 500 cycles
& k2 D" }' I( K7 T7 u; Q! V

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