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非常好的资料，前一阵子贴在个人主页上，忘发论坛上来了。
, e- x p/ s6 Q4 }' n【目录】：$ v0 L( P' T0 c. i, n5 H5 L5 F
第一章 高速数字电路概述..........................................................................56 r, B" O& G$ x" f
第二章 传输线理论...............................................................................126 a H9 v0 K Y3 m! A
第三章 串扰的分析...............................................................................42
9 U [( I% p0 p, }' v8 `: b6 [5 h第四章 EMI 抑制................................................................................60: C b+ y+ O4 r
第五章 电源完整性理论基础......................................................................82 {+ X `1 k% t, ?! P* {: W
第六章 系统时序................................................................................100
`* k8 s# p- O! ^4 P; R8 T3 Q$ K9 M: a第七章 IBIS 模型...............................................................................113
8 w3 a1 L- `5 _% ~. ]第八章 高速设计理论在实际中的运用.............................................................122+ K+ ~- Y4 ] k" |: B$ \& z. G
第二部分：DRAM 内存模块的设计技术..............................................................143
- N/ R! G+ e7 E; ?# B第一章 SDR 和DDR 内存的比较..........................................................................1431 ^* a5 I6 _6 v1 M% l' i$ z
第二章 内存模块的叠层设计.............................................................................145( k6 ~; d( }9 @$ J2 ?0 \* l' I
第三章 内存模块的时序要求.............................................................................149
1 @6 m/ X: G2 h' F: K. t' w& m3.1 无缓冲（Unbuffered）内存模块的时序分析.......................................149( u/ a- n$ t& C/ L; t9 Y
3.2 带寄存器（Registered）的内存模块时序分析...................................154
" `7 a& i' W9 q4 `$ O$ y4 J: \! Q第四章 内存模块信号设计.................................................................................159% j7 S$ K [ {% Y* Z$ ~+ C. W
4.1 时钟信号的设计.......................................................................................159
% b7 y0 M8 w. H5 m% x4.2 CS 及CKE 信号的设计..............................................................................162
! `& v' c8 s. }4 l4.3 地址和控制线的设计...............................................................................1638 R) B, y/ c4 }
4.4 数据信号线的设计...................................................................................166
|8 s7 |/ }0 K; D6 Y& h4.5 电源，参考电压Vref 及去耦电容.........................................................169- z1 B8 G2 P$ ~( ]; h0 i# ^& d
第五章 内存模块的功耗计算.............................................................................172
# W7 ~' A; {9 G第六章 实际设计案例分析.................................................................................1786 g9 W2 u/ D% a3 @& {
第三部分 SPECCTRAQUEST 仿真指南...........................................................188
; r6 k3 E, g# Q+ B3 u第一章 cadence SPECCTRAQUEST 的简介...............................................................188/ u0 s3 Y. L2 U
1.1 SPECCTRAQuest SI Expert.....................................................................189# N/ P5 w+ k3 i" K) `
1.2 SPECCTRAQuest Power Integrity.........................................................1890 u A* ^' o9 J2 s9 U5 V! x z
1.3 SPECCTRAQuest for IC Packaging.......................................................189
% p* b+ q; L% }: E7 o- x3 K1.4 SPECCTRAQuest Signal Explorer.........................................................189
+ \& s3 ^4 P) h( q0 q第二章 CADENCE SPECCTRAQUEST 的基本运用.................................................190
" X- c1 j( j' t% u2.1 仿真前的准备工作...................................................................................190
; d* k9 O5 b2 l: E- g. x2.1.1 获取元件的IBIS 模型.....................................................................190) g+ G+ @; L. e5 b. O+ A4 _3 w
2.1.2 转换IBIS 文件格式及调入模型.....................................................1902 y% ]% i& S2 y; \9 V4 h$ b
2.1.3 给元件加载对应的模型...................................................................192
$ _6 G; T. @: |5 ~0 t8 k2.1.4 定义电源电压...................................................................................194* j+ ~/ K$ k$ U, W/ J4 q- x% o
2.1.5 PCB 叠层设置....................................................................................195* I. [' n3 `2 ~4 T5 X
2.1.6 仿真参数的确定...............................................................................196
4 H# Q" C# G) ^# K7 s) b9 r0 U( V; r3 a2.2 设计后仿真的过程...................................................................................197
4 Z, ]. W0 F" @! u P' g) o* g2.2.1 确定准备工作已经做好...................................................................198( `# U% H# ]" P% n) ]: @
2.2.2 选择信号线.......................................................................................198
; z" t# R/ n9 l2.2.3 提取电路拓扑结构...........................................................................199* d* B" E" I j& \
2.2.4 选择不同的驱动激励和元件参数进行仿真...................................2007 P/ }; ] g0 n
2.2.5 仿真结果的分析...............................................................................201
( ]5 X8 \( p6 e( z8 T( y! [2.2.6 SigWave 的使用................................................................................202
X! S' U+ p$ c& r2.2.7 后仿真的收尾工作...........................................................................203* x1 l# }' P, h1 o
2.2.8 一些补充...........................................................................................203
+ @' X- u7 U7 `4 E2 z6 G2.3 设计前仿真的过程...................................................................................204; u$ P) \; p$ L" S3 q) s
2.3.1 布局前的前仿真...............................................................................204
2 m8 B, Q- _ d7 S: f" d6 q: K2.3.2 布局后的前仿真.................................................................................207+ z& g1 S C Z0 \$ J0 k& p+ C
第三章 SPECCTRAQUEST SI EXPERT 的进阶运用..................................................2093 I" j _7 K" }9 @% i/ _, V
3.1 高速系统级设计和分析...........................................................................209: ~# e, q) `4 o3 }# X! i. f
3.2 高速设计的问题.......................................................................................209
# j" b7 _+ q7 Y, c4 u: l2 q3.3 SPECCTRAQuest SI Expert 的组件.......................................................210$ R+ k5 V# s/ p7 I% d0 ~* j
3.3.1 SPECCTRAQuest Model Integrity .................................................210
8 w" I% @7 c1 z; P3.3.2 SPECCTRAQuest Floorplanner/Editor .........................................215
0 N( [- t6 @8 P/ ]+ ]4 J3.3.3 Constraint Manager .......................................................................2166 o8 y4 h0 q2 N8 Y s9 @
3.3.4 SigXplorer Expert Topology Development Environment .......223$ ?. @+ r& `, k$ R2 p4 g
3.3.5 SigNoise 仿真子系统......................................................................225
q% |" D$ H8 Y9 x1 ~3.3.6 EMControl .........................................................................................230' e0 ~8 R- m. j5 I9 X* Z
3.3.7 SPECCTRA Expert 自动布线器.......................................................230 P6 ^) T9 u8 p( l" H" p
3.4 高速设计的大致流程...............................................................................2308 y7 a, P; F, i1 ^4 j
3.4.1 拓扑结构的探索...............................................................................2319 k4 [, l4 t' H
3.4.2 空间解决方案的探索.......................................................................231
) p; i) _: n# U9 ]3.4.3 使用拓扑模板驱动设计...................................................................231
! J9 B' q& J& n# ?/ C {, y/ ^4 A3.4.4 时序驱动布局...................................................................................232 _! s& Q* Q) v, t* D. a
3.4.5 以约束条件驱动设计.......................................................................232
4 ]( p; `( X8 V8 p: b# W3.4.6 设计后分析.......................................................................................233
, N$ U' c# b# @# L3 B- b第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2342 R: O# K- ?& m! D0 i
4.1 SPECCTRAQuest Signal Explorer 的功能包括：................................234
, C/ E- m$ u& y9 z4 Y$ [" P' E1 @4.2 图形化的拓扑结构探索...........................................................................234
5 ?+ Q: X1 h) w* [4.3 全面的信号完整性(Signal Integrity)分析.......................................234" x9 z6 ~; F8 o/ l+ b j- ]# K
4.4 完全兼容 IBIS 模型...............................................................................234' U M- p# X1 D( K0 ^
4.5 PCB 设计前和设计的拓扑结构提取.......................................................235) S: c' G, P6 _; y* p3 E
4.6 仿真设置顾问...........................................................................................235
) l. N; u$ {" G8 O! o5 y4.7 改变设计的管理.......................................................................................235+ q% q+ I* U0 Z
4.8 关键技术特点...........................................................................................236
; a( F7 A8 R4 P8 m# Y7 V4.8.1 拓扑结构探索...................................................................................236
# h P; G2 {; y) c4.8.2 SigWave 波形显示器........................................................................236( I& F& w) r9 Q/ f
4.8.3 集成化的在线分析(Integration and In-process Analysis) .236
' Y9 ?( w1 ?0 l第五章 部分特殊的运用...............................................................................2373 ^6 n4 }! i" P
5.1 Script 指令的使用..................................................................................237
5 |5 I1 t& A/ n" ~) E4 v5.2 差分信号的仿真.......................................................................................2435 _7 h: j* b/ B% Q) i8 Q+ n
5.3 眼图模式的使用.......................................................................................249
4 x0 ]6 A ~/ P# Z _9 k6 S; K第四部分：HYPERLYNX 仿真工具使用指南............................................................251
' Z1 M% {% A1 ~, p. D第一章 使用LINESIM 进行前仿真.......................................................................251; G# a4 e0 R) D- ~0 x, P% ^' E. @
1.1 用LineSim 进行仿真工作的基本方法...................................................251$ i+ W9 d. N0 O: ~3 M1 A
1.2 处理信号完整性原理图的具体问题.......................................................259
" F) u. E0 w6 h1.3 在LineSim 中如何对传输线进行设置...................................................260
+ N2 Z9 a; Q% e, x9 _1.4 在LineSim 中模拟IC 元件.....................................................................263" z0 N# U$ h5 H& k8 L
1.5 在LineSim 中进行串扰仿真...................................................................268
+ ^4 l' P: D' s4 p第二章 使用BOARDSIM 进行后仿真......................................................................273
4 H8 u7 z* s6 b# Z9 w# f) Z' A% I2.1 用BOARDSIM 进行后仿真工作的基本方法...................................................273
, R4 p3 Y8 o7 m2.2 BoardSim 的进一步介绍..........................................................................292% O- P0 y& F* e/ ^/ ~, G4 f
2.3 BoardSim 中的串扰仿真..........................................................................309, `9 P% ]. O1 ?& I, f% _. a M
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发表于 2007-12-20 12:27
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发表于 2007-12-20 20:20
好东西怎么没人顶！！！