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非常好的资料，前一阵子贴在个人主页上，忘发论坛上来了。
: I. n# o4 Q; {【目录】：; X2 Y* O8 z8 l/ [
第一章 高速数字电路概述..........................................................................5
: f; M" c B! `( U第二章 传输线理论...............................................................................12
, G/ C" G- y" S5 r/ p' A第三章 串扰的分析...............................................................................42
8 @6 j7 g, F% U, O- g8 S第四章 EMI 抑制................................................................................60: M% ?/ {( J6 i: k+ x! L: e6 H
第五章 电源完整性理论基础......................................................................82( ]; X$ w9 q5 [& h, |7 x- y9 d
第六章 系统时序................................................................................100
0 H: \% E1 m! V. A! T) `3 j- p5 ~# ~第七章 IBIS 模型...............................................................................113
3 d X9 `" ^- ^7 e0 A& t n( `第八章 高速设计理论在实际中的运用.............................................................122/ D4 n5 M, U5 e& m
第二部分：DRAM 内存模块的设计技术..............................................................143, @' D) R: }& g. e( ]1 T4 K
第一章 SDR 和DDR 内存的比较..........................................................................1439 u- N% P( T% @4 X$ M) i) }
第二章 内存模块的叠层设计.............................................................................145
3 N0 b6 }7 b8 \9 j% q' x& b第三章 内存模块的时序要求.............................................................................149% x: ^& w- j( M
3.1 无缓冲（Unbuffered）内存模块的时序分析.......................................149 U3 h! w2 s4 m" F J" v) k. A1 E
3.2 带寄存器（Registered）的内存模块时序分析...................................154* R5 ]$ U' _! }8 r% w. [
第四章 内存模块信号设计.................................................................................159
0 {6 N/ I) E2 ?/ y, K K4.1 时钟信号的设计.......................................................................................1594 O( i' B/ Y5 X! I, ]
4.2 CS 及CKE 信号的设计..............................................................................162
6 X' ^1 f& p" M2 l9 I4.3 地址和控制线的设计...............................................................................163
5 P( X% @4 w; F3 X3 V9 [3 D" T4.4 数据信号线的设计...................................................................................166
: {+ s/ x! ^# ?, W+ S1 Q* R2 L5 W4.5 电源，参考电压Vref 及去耦电容.........................................................169$ c: T2 `# q3 G3 ^# t& u
第五章 内存模块的功耗计算.............................................................................172( W( k# g" t; E/ P/ `. J3 V
第六章 实际设计案例分析.................................................................................178
5 l, n; S# Q+ Z7 y9 H, D# n2 S" b, V/ Y第三部分 SPECCTRAQUEST 仿真指南...........................................................188' j! c7 }: d- q* l
第一章 cadence SPECCTRAQUEST 的简介...............................................................188* L: Y4 c0 [9 Q. z: s7 x
1.1 SPECCTRAQuest SI Expert.....................................................................1896 a! g7 F5 \. F* R! L7 v3 L4 [9 b
1.2 SPECCTRAQuest Power Integrity.........................................................189
: k- R1 C) X7 G1.3 SPECCTRAQuest for IC Packaging.......................................................189
: L' d3 t7 r S: i1.4 SPECCTRAQuest Signal Explorer.........................................................189
; `) Y: o i1 `' _4 |第二章 CADENCE SPECCTRAQUEST 的基本运用.................................................190
: S: r, b3 O0 j0 h4 S$ c2.1 仿真前的准备工作...................................................................................190
6 B) L8 W! t& I0 |: x t9 X2.1.1 获取元件的IBIS 模型.....................................................................190" q1 V- k) \+ O, H9 a2 w9 ?
2.1.2 转换IBIS 文件格式及调入模型.....................................................190+ g. ?3 s0 L* U; ]
2.1.3 给元件加载对应的模型...................................................................1929 a$ E w0 [- r
2.1.4 定义电源电压...................................................................................194
: r0 y" |: r( K2 c c0 y2 z$ O, O2.1.5 PCB 叠层设置....................................................................................195
/ C) C7 R* [8 y" v2.1.6 仿真参数的确定...............................................................................196
1 o2 B+ R' x3 |% H; j6 I; @2.2 设计后仿真的过程...................................................................................197
4 z* f- h$ C/ g$ N- ]5 O6 T2.2.1 确定准备工作已经做好...................................................................198: Q4 g. L' {' F; N" [ G
2.2.2 选择信号线.......................................................................................198! f. D# ~+ d! T. m* o
2.2.3 提取电路拓扑结构...........................................................................1995 C1 O$ x" u3 m+ k/ P
2.2.4 选择不同的驱动激励和元件参数进行仿真...................................200: h4 d7 y+ Z) ?( A6 A( d
2.2.5 仿真结果的分析...............................................................................2013 o; Y, }0 w* i4 B! j
2.2.6 SigWave 的使用................................................................................202# C6 ?# x2 F' r8 h# O* K
2.2.7 后仿真的收尾工作...........................................................................203/ w6 [% B. _& e+ A: V; e
2.2.8 一些补充...........................................................................................2032 j7 y' A5 F& J/ \# c' G1 `
2.3 设计前仿真的过程...................................................................................2044 F% J7 g; p8 D/ e5 m
2.3.1 布局前的前仿真...............................................................................204
4 [+ R5 p! s) b4 \9 r; M5 t2.3.2 布局后的前仿真.................................................................................2077 D- a H' A, i# G& ]5 t
第三章 SPECCTRAQUEST SI EXPERT 的进阶运用..................................................209( K* ]1 [; [1 Y5 F
3.1 高速系统级设计和分析...........................................................................209
e. d5 O3 g, K3 j$ Q4 h" R3.2 高速设计的问题.......................................................................................209
( U0 T* |7 S8 H5 F% p/ ~3.3 SPECCTRAQuest SI Expert 的组件.......................................................2101 d/ ~; z1 I5 ~! |. k$ ?! C
3.3.1 SPECCTRAQuest Model Integrity .................................................210
# q! ]( B Q. ?0 W A# [- U3.3.2 SPECCTRAQuest Floorplanner/Editor .........................................215+ k: G$ W9 r) O' k# C: ?
3.3.3 Constraint Manager .......................................................................216- A! I- ~# y8 o! w* C
3.3.4 SigXplorer Expert Topology Development Environment .......223
7 P! ^3 R y5 C+ C3.3.5 SigNoise 仿真子系统......................................................................2251 L' H% L7 p( D. Y: S5 j
3.3.6 EMControl .........................................................................................230
; S! Y2 T+ A! r$ G* Z3.3.7 SPECCTRA Expert 自动布线器.......................................................230
9 W" C" }+ T, ~* N3 N2 z3.4 高速设计的大致流程...............................................................................230
) ?$ f# [# l$ g1 x# v' m3.4.1 拓扑结构的探索...............................................................................231
) D3 R m4 r! b9 x: q7 {3.4.2 空间解决方案的探索.......................................................................231
; r& [$ j k5 m; s9 P' Y) {, Z/ f, h3.4.3 使用拓扑模板驱动设计...................................................................231
* R! `1 N, R) I5 C3.4.4 时序驱动布局...................................................................................232
7 ~$ t& I# E* F3.4.5 以约束条件驱动设计.......................................................................2328 g; L6 z& k+ D' V" c
3.4.6 设计后分析.......................................................................................233; [' F% m. x% o, s9 @ a2 [- S
第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................234
6 C4 ]+ v7 }( t6 n4.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2347 a2 M" X& ]- S y& A7 H. m
4.2 图形化的拓扑结构探索...........................................................................234
3 X: s+ V |7 X0 h3 v1 A4.3 全面的信号完整性(Signal Integrity)分析.......................................234. v5 E$ l" `7 b) O4 h
4.4 完全兼容 IBIS 模型...............................................................................234$ i# a( i0 Q4 `, ` Z
4.5 PCB 设计前和设计的拓扑结构提取.......................................................2351 ?5 c! a: u! [8 n; A: d
4.6 仿真设置顾问...........................................................................................235
0 H1 i5 p$ f. M# }% g u% C8 E- [4.7 改变设计的管理.......................................................................................2359 `+ ~3 ~# n" |' |/ |! l
4.8 关键技术特点...........................................................................................236
3 T3 q$ Y8 X% [7 b9 U4.8.1 拓扑结构探索...................................................................................2369 A+ ~3 L1 M) Z6 h0 v. l
4.8.2 SigWave 波形显示器........................................................................236# {2 s" ^0 \" _7 t/ G T+ v
4.8.3 集成化的在线分析(Integration and In-process Analysis) .236. F! ~% u8 O4 @6 p" ]
第五章 部分特殊的运用...............................................................................237
. H. I1 P9 K0 g. M. b( b/ E. N5.1 Script 指令的使用..................................................................................237
& c; q7 C5 A* j! }5.2 差分信号的仿真.......................................................................................243
% z/ m" y" \- z* k5.3 眼图模式的使用.......................................................................................249
( |. q; c8 v6 m9 m ?, N第四部分：HYPERLYNX 仿真工具使用指南............................................................251
' g4 [9 N# d. S3 O) p ^- U第一章 使用LINESIM 进行前仿真.......................................................................251
# `7 [1 {" b6 z3 }1 z( `. G, V1.1 用LineSim 进行仿真工作的基本方法...................................................2517 U; T+ B8 Q m8 H
1.2 处理信号完整性原理图的具体问题.......................................................259
- f0 E' J1 x! S7 m! m7 o/ [1.3 在LineSim 中如何对传输线进行设置...................................................260
/ T( E; R! d$ O1.4 在LineSim 中模拟IC 元件.....................................................................263
) s/ |9 _, w$ s) I$ F' n0 A1.5 在LineSim 中进行串扰仿真...................................................................268. d/ m3 t4 o/ L' Q; x
第二章 使用BOARDSIM 进行后仿真......................................................................273; x) a9 k5 R4 \ o! }% s
2.1 用BOARDSIM 进行后仿真工作的基本方法...................................................273
* |) d8 k: H1 s a7 _& g4 E1 I2.2 BoardSim 的进一步介绍..........................................................................292; p' m, _3 ^9 [$ }7 _5 `1 L
2.3 BoardSim 中的串扰仿真..........................................................................309
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发表于 2007-12-20 12:27
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发表于 2007-12-20 20:20
好东西怎么没人顶！！！