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PCB Stackup and Layer Order中:' V4 o# g4 c: X* j/ A/ j
Power supplies with high transient current should have their associated VCC planes close to the
! U$ V+ S* @ N0 {( a: itop suRFace (FPGA side) of the PCB stackup to decrease the distance in the vertical direction
$ p x# v* n1 A. s4 Y2 R6 Vthat currents travel through VCC and GND vias before reaching the associated VCC and GND! c/ Z: l. Q8 Y# C/ d5 o0 f" j2 @
planes. As mentioned in the previous section, every VCC plane should have a GND plane
5 `6 u! a4 Y6 t. F9 L" o7 Cadjacent to it in the stackup to reduce spreading inductance. Since high-frequency currents
" N& [8 Z r& V" u+ J* pcouple tightly due to skin effect, the GND plane adjacent to a given VCC plane tends to carry the0 r/ l3 R2 Y! H
majority of the current complementary to that in the VCC plane. For this reason, adjacent VCC
7 H1 M! K1 T( Qand GND planes are considered as a pair.
& H! ~7 x+ k$ Q; g這裡面,說的VCC,GND層到底所何放置?8 g2 [& `+ i k3 G. e& I0 x% R
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发表于 2007-12-28 17:23
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