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发表于 2007-12-28 17:23 | 只看该作者 回帖奖励 |倒序浏览 |阅读模式

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PCB Stackup and Layer Order中:
% x8 E! X" B3 L  YPower supplies with high transient current should have their associated VCC planes close to the6 d8 O  ?5 z6 N1 c" D
top suRFace (FPGA side) of the PCB stackup to decrease the distance in the vertical direction: m( q3 \0 S8 N6 p
that currents travel through VCC and GND vias before reaching the associated VCC and GND# b! g$ g$ H7 T) N
planes. As mentioned in the previous section, every VCC plane should have a GND plane( w  _, P$ a2 G
adjacent to it in the stackup to reduce spreading inductance. Since high-frequency currents
4 W  Y$ A5 y& r6 L+ }couple tightly due to skin effect, the GND plane adjacent to a given VCC plane tends to carry the
3 l5 f" X0 X3 b- a+ J" J# [majority of the current complementary to that in the VCC plane. For this reason, adjacent VCC
, k" y. H/ q, Z0 ^/ j5 D* ^and GND planes are considered as a pair.
& p. ^$ j' U1 ?
這裡面,說的VCC,GND層到底所何放置?
8 E8 V6 D" z: v2 F: U0 y謝謝!
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2#
发表于 2007-12-29 09:55 | 只看该作者
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liujie123 该用户已被删除
3#
发表于 2007-12-29 11:28 | 只看该作者
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