Both TH and Blind/Buried Via together?

karpcb15

I designed  4 layer substrate using both Through hole (L1-L4) and Blind(L1-L2 , L3-L4) , buried vias(L2-L3) . Is this possible to Manufacturer?
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xyylucky

这样做的话，怎么压板啊？想不出来。
如果是埋孔加通孔，L1+（L2+L3)+L4这样压，还可以。
! Q& f  |3 x* q$ z要不改成6层板，问问工厂能不能按假6层做。

karpcb15

We proposed the stcakup to manufacturer is 4 layer stack up with laser vias from layer 1 to2 ,2 to3 and 3 to 4 ,mechanical via from layer 1 to 4.
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0 x6 O1 W' v+ W. {# J8 U, Xbut Manufacturer splitted the mechanical vias from layer 1 to 4 in to stacked vias

7 E2 n6 W* r+ x1 GMy question is why manufacturer changed mechanical via to stacked via?

# Z9 k% c/ I4 \! vcost also will increase while using stacked vias?
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xyylucky

工厂有没有给你们提供叠层结构，工厂有没有说，他们修改的原因， 另外提出问题的人是你们公司的PE 工程师还是硬件工程师？

xyylucky

在我的认知里，想不出用什么工艺来实现，抱歉。

zltwin

博运发

kentwong2018

Yes ... It's a normal layer stack-up(1+2+1).