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Two categories of adhesive systems, thermoplastic and thermoset, have been used when bonding
9 t: Q# i0 R' \4 QRT/duroid 5870/5880 multilayers. Thermoplastics, such as DuPont’s FEP film or Rogers’ 3001 film, are typically selected when
0 q& n3 w3 @/ @5 h$ t+ h7 Lelectrical properties of the adhesive layers are critical. The dielectric constant and dissipation factor of FEP is 2.1 and 0.0003.
' \; \% r6 X f. P/ lThe dielectric constant and dissipation factor of 3001 film is 2.28 and 0.003. Thermosets, such as FR-4 prepreg can be chosen; e9 g5 t% |/ \0 L
when electrical properties are less critical. |
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