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EDA365欢迎您登录!您需要 登录 才可以下载或查看,没有帐号?注册  专业术语简介
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 决定出去见识见识,出去后与同事交流时6 g3 m3 m& Y4 u5 t
 dummying为何物?所以呢这些术语不知道到底有多大的用处,但
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 :Printed circuit board,印刷电路板; 7 T7 p: F1 w. P  T) n# \
 : Flexible Printed circuit,柔性电路板,也称挠性电路板,俗称软板;
 ( h; ^" |: H  w/ V. i:Copper Clad Laminates,铜箔基材;
 1 S# Z9 ?+ c  D8 K9 }* F; U1 |& q+ t: [8 i:Flexible Copper Clad Laminates,柔性铜箔基材;
 4 \; g( _3 T$ X: }9 P% ^0 B1 n:Roll Anneal Copper Foil,压延铜;
 0 q* Y1 k# O# V9 `:Electrolysis Desposition Copper Foil,电解铜; 8 `+ p0 T$ V& A' F9 e' I
 :Adhesive,粘接剂,俗称胶; 0 B7 U: k) @' z, U
 :Polyimide,聚亚酰胺;
 . n/ y5 x( _% |:Cover lay,覆盖膜,日资厂称为保胶、有的厂称为包封等
 ' ^! f, Y3 e+ X# O% Q$ r:Solder Resist,阻焊; 5 T0 z3 h# y& H  w
 :电磁屏蔽膜; 1 i: Z# n  h9 L+ t. b  T
 :Prepreg,半固化片,也称黏结片 + u  z! w4 s: ~( B' V# G4 g
 :Liquid Crystal Polyme,液晶聚合物 * b0 ]1 t8 T: D8 i
 :Plated Trough Holes,镀通孔 1 \7 E; g5 j$ \* a! z, M! j
 :No Plated Trough Holes,
 6 l6 D+ Y! I/ {4 g% b( C:Blind Via Holes盲孔 * A1 Q6 W# r- {' H# G5 N# Y. I
 :Electroless Nickel Immersion Gold无电解(化学)镍金 2 |4 }0 j8 \# ?) f  d( J6 k
 :Electroless Nickel Electroless Palladium Immersion Gold无电解(化学)
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 :Organic Solderability Preservatives,有机可焊性预处理; % n7 |# L1 h6 j3 k. i) _! z
 :Integrated Circuit,集成电路;
 / F- M1 s4 m4 i0 w:Automatic Optic Inspection;自动光学检查;
 , Z* H5 p# d4 s3 x7 k& g:Vertical Continuous Plate,垂直连续电镀;
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 :SuRFace Mount Technology,表面贴装技术; + h8 g- o5 I9 `/ W( G
 :Design For Manufacture,可制造性设计;
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 :Developing Etching Stripping显影、蚀刻、去膜
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