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The 5 x+ B6 x' I$ v; g
leads of components are connected to ground , \/ ?; H9 H C. x3 H- {
or power by soldering them into plated through 1 [, `! w( \ O c( ]5 c7 c$ f
holes. Since copper conducts heat well, solder-5 s s; ]4 ]" x, S7 m& W! o
ing to a plane layer could require an excessive
2 T5 v Y9 q0 x! u. M- E8 Wamount of heat, which could damage the com-2 _5 T- `2 K, \; V+ n4 i
ponents or the plating in the hole (called the barrel). Thermal reliefs are used to reduce the path for heat conduction but maintain 1 \ `( ~( i4 M. }
electrical continuity with the plane. |
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