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The & ]5 }1 `8 }" ~
leads of components are connected to ground
) {- c. l6 a) t# z- Bor power by soldering them into plated through
0 w& v& U! _( Uholes. Since copper conducts heat well, solder-
! a& z; U7 ^9 D* S, x+ cing to a plane layer could require an excessive 4 t, s* ~/ n* R% n' f
amount of heat, which could damage the com-
8 C* A$ C; A2 j: zponents or the plating in the hole (called the barrel). Thermal reliefs are used to reduce the path for heat conduction but maintain ^3 {/ e& E( D; \5 b- @
electrical continuity with the plane. |
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