|  | 
 
| 
发我简历 107777719@qq.com , 我帮你推荐,成功率++++。9 m% G, O! {/ Q3 d1 ?4 O1 a6 y7 N' Q1 Q
x
EDA365欢迎您登录!您需要 登录 才可以下载或查看,没有帐号?注册  " _/ Q* c' R2 m% h$ b9 ~
 1 r8 `  }8 a* {4 h2 U
 Duties & Responsibilities1.        Responsible for routine PCB layout designs.
 ]; m& C/ Q7 H  y1 s2.        Work close with hardware/process engineers to ensure circuit and process requirements are well defined and incorporated into the board design. ) ^0 J9 X. T, w) N
 3.        Generate documents per design flow and rules, submit for peer review and attach to file system after that.
 * H/ R* l3 ~6 q  o4.        Actively participate in technical discussions at the early design phase.
 3 Z$ V2 P# y6 J9 r1 g6 E5.        Review and verify the layout designs per the checklist for others. ' z  |- H. C5 U
 6.        Work close with PCB suppliers to make a "buildable" PCB/Flex, participate in DFM replies for some special cases.
 % F( d5 W( Q5 C0 C0 m  \8 G8 B; i& H1 Z1 a
 
 2 j0 Q- @/ L2 S4 k" E8 }Qualification & Requirements
 ' Z; e0 r1 y9 Y1.        BS or higher in electrical engineering or equivalent. ( [; W4 k8 G. G. Y( x
 2.        8+ years multilayer board design experience with RF, mixed-signal circuit and HDI, familiar with blind/buried vias application, capable of implementing guidelines into design. 3 N, q% r$ Y$ P# T4 l
 3.        In Depth knowledge of High-Density Interconnect (HDI), substrate design and its associated design rules.
 . A& Y2 K( M& L* m, H8 \) \0 Q4.        Ability to derive a balanced design to satisfy manufacture ability and project goals such as performance & density.
 2 k  z9 L3 D1 O( D4 `7 _6 `! T2 K5.        At least as an expert in one of PCB design tools, mentor pads design experience and allegro is preferred. 2 h! y$ ~" E1 O# j- G& Z0 B% k
 6.        Experience on PCB post-processing tools like CAM350, AutoCAD, BluePrint is preferred.
 " _+ q% O- [, i! [  ?" m7.        Know of rigid board manufacturing process, like Tenting, m-SAP and extended knowledge of FPC manufacturing is a plus.
 ) m" c# }+ I& {, S- C8.        Self-motivated, hard-working, capable of completing assignments under the pressure of urgent schedule and high design requirements. ) e1 d2 u0 X, w/ m+ V& y
 9.        Good English communication skill.
 - d3 H. s7 _' n2 z4 i# \& g  R: D" s( o8 n; i* H9 m
 
 ' r2 O5 C  m# ?7 o
 2 c/ f. X2 [4 U  v1 }) G( I9 ^$ t
 " C8 r9 C2 b8 H& m/ x% V
 + a4 g( p4 d( v& P
 | 
 |