Cadence package design software 5 O4 p# O! l1 `3 E2 r( O6 I* VAPD --> Allegro Package Design --> mainly used for side by side DIE placement ( }: {8 K/ j% J/ F) ?SIP --> System In Package --> mainly used for Stacked DIE with integrated Passive components& G/ {4 X/ u8 x- U. w( |' n