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本帖最后由 CAD_SI 于 2010-1-25 03:12 编辑 0 G. o* H7 g. F& v5 ]
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光绘格式为 274-D时:
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anti pad 不一定要比 regular pad 大
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一般 anti pad 只要比钻孔孔径大30到40mil就可以了,不同的封装可能也不一样. D1 {/ B8 i# E* G+ @ T% h
& ~. F/ m8 c9 c% S" T- {9 t如下图(CAM350截图,光绘格式:274-D):红色为TOP层,黄色为第二层GND,绿色为钻孔: Q( O# C6 d6 X& o$ w
, @2 M; V, U# L5 A4 L- d! I. T可以看出 anti pad 是比 regular pad 小的
+ B- m1 F: u6 B, t- ?$ O. g$ Y' {其实在负片中 anti pad 和 regular pad 之间没有关系,在负片中没有 regular pad
" ]& f: J/ e; Q5 x8 `. n+ hallegro在输出负片光绘时不输出 regular pad,即无盘工艺
+ p7 l, x" K% h9 ^% qanti pad 只与钻孔孔径有关。
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光绘格式为 274-X 时:
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光绘为复合层,即每层光绘由多层复合而成$ J) C( Q. u. g6 L9 f
如下图(光绘格式为:274-X)% r+ W( W; R% t5 L8 X7 @
regular pad 也会输出,红色为 anti pad,黄色为 regular pad
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: Y w2 h a3 E0 y) W( z L此时要选中选项:suppress unconnected pads1 y4 I5 R! q( d7 H6 i
Z" X7 y! I1 z+ ~2 E不然在出光绘时会有警告:
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WARNING: Negative layer being processed with "suppress unconnected
' @ l( c: {' V I pads" option disabled. This may result in shorts if regular
2 @6 h- {3 s" a pads are defined larger than anti-pads in padstack definition.
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# C. k1 S0 F) O即:regular pad 比 anti pad 大时会造成短路。) K& H2 l9 M2 \& O0 N9 o
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如果选中选项:vector based pad behavior 则 regular pad 不在光绘里输出。9 U' p. |. u8 k0 F, F
Vector-Based Pad-Type Behavior
: v: [# N$ ^6 `3 t6 B/ xIn determining pad-type behavior, APD uses either regular, thermal, or antipad for pins and vias during the artwork process. For vector-based artwork, APD makes a decision based on the film mode: positive or negative. For positive film, APD always uses the regular pad-type. For negative film, it uses either the thermal or antipad depending on whether the pin or via is connected to the shape.
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5 Q+ l- g: i, f" }' h, s+ V7 H所以如果光绘格式用 274-X ,在生成光绘后记得看一下 LOG。7 W; H6 m7 Z/ B% i6 g5 {. }" s9 O
) V6 N% Z3 A0 m% H; h用 274-D 就没有这方面的考虑,也不用做FLASH。但是用CAM350查看光绘时
$ n, B% }/ n8 }+ P2 e会出现有D码没定义的情况,此时需修改 ARL 文件,部分PCB厂家可能也无法识别* {3 ?8 V+ O7 J! Z' {
没定义的D码,有可能发生质量事故。 |
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